Lubomyr T. Romankiw and The Influence of Lithographic Patterning on Current Distribution: A Model for Microfabrication by Electrodeposition

摘要

This paper (see next page) is truly seminal in that it enabled the implementation and the scale-up to 300 mm wafer size of electrodeposition through lithographic patterns. As stated in the text "the work developed the understanding of the various factors that cause nonuniform thickness distribution in electrodeposits." The computational model described in the paper explains in detail the science of controlling the current and thickness distribution across the openings of a densely or sparsely defined lithographic pattern.