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Direct microfabrication of oxide patterns by local electrodeposition of precisely positioned electrolyte: the case of Cu2O

机译:通过局部电沉积精确定位的电解质直接微制造氧化物图案:以Cu2O为例

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摘要

An efficient technique for writing 2D oxide patterns on conductive substrates is proposed and demonstrated in this paper. The technique concerns a novel concept for selective electrodeposition, in which a minimum quantity of liquid electrolyte, through an extrusion nozzle, is delivered and manipulated into the desired shape on the substrate, meanwhile being electrodeposited into the product by an applied voltage across the nozzle and substrate. Patterns of primarily Cu2O with 80~90% molar fraction are successfully fabricated on stainless steel substrates using this method. A key factor that allows the solid product to be primarily oxide Cu2O instead of metal Cu – the product predicted by the equilibrium Pourbaix diagram given the unusually large absolute deposition voltage used in this method, is the non-equilibrium condition involved in the process due to the short deposition time. Other factors including the motion of the extrusion nozzle relative to the substrate and the surface profile of the substrate that influence the electrodeposition performance are also discussed.
机译:本文提出并演示了一种在导电基板上写入二维氧化物图形的有效技术。该技术涉及用于选择性电沉积的新颖概念,其中通过挤压喷嘴将最少量的液体电解质输送并操纵到基板上,使其形成所需的形状,同时通过喷嘴和电极之间施加的电压将其电沉积到产品中。基质。使用该方法成功地在不锈钢衬底上成功地制作了主要由摩尔分数为80〜90%的Cu2O组成的图形。考虑到该方法使用的绝对沉积电压非常大,使固体产物主要是氧化物Cu2O而不是金属Cu的关键因素是平衡Pourbaix图所预测的产物是该过程中涉及的非平衡条件,这是由于沉积时间短。还讨论了其他因素,包括挤压喷嘴相对于基板的运动以及影响电沉积性能的基板表面轮廓。

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