首页> 外文期刊>Progress in Organic Coatings: An International Review Journal >IPN structured UV-induced peelable adhesive tape prepared by isocyanate terminated urethane oligomer crosslinked acrylic copolymer and photo-crosslinkable trifunctional acrylic monomer
【24h】

IPN structured UV-induced peelable adhesive tape prepared by isocyanate terminated urethane oligomer crosslinked acrylic copolymer and photo-crosslinkable trifunctional acrylic monomer

机译:IPN结构紫外线诱导的可剥离可剥离粘合带,由异氰酸酯封端的氨基甲酸酯低聚物交联丙烯酸共聚物和光可交联三官能丙烯酸单体

获取原文
获取原文并翻译 | 示例
获取外文期刊封面目录资料

摘要

In this paper, a linear isocyanate terminated urethane oligomer, polyethylene glycol modified isophorone diisocyanate oligomer (PEG-IPDI), was prepared by the reaction of polyethylene glycol and isophorone diisocyanate. It is mixed as a cross-linking agent with an acrylic copolymer composed of 2-ethylhexyl acrylate, butyl acrylate, methyl methacrylate, hydroxyethyl acrylate and acrylic acid to form a network pressure sensitive adhesive (PSA) through the reaction of isocyanate groups in PEG-IPDI with hydroxyl and carboxyl groups in acrylic copolymer chains. By blending this network PSA with a photo-initiator and a trifunctional acrylic monomer in a certain ratio, the UV-curable PSA was obtained. After uniformly coating it on the treated polyethylene terephthalate film, a UV-induced peelable PSA tape for a silicon wafer dicing process was prepared. The PSA network formed before UV irradiation was held together with another network produced by UV irradiation of the trifunctional acrylate monomer to give an interpenetrating network (IPN) structure. The results showed that this novel UV-curable PSA tape with IPN structure had strong peel strength before UV irradiation, and could meet the fixed requirements of silicon wafer cutting process. After UV curing, the peel strength was remarkably lowered due to the formation of IPN structure. Compared to those semi-IPN structured PSA tapes prepared with traditional multi-functional urethane acrylate oligomers, the adhesion performances of IPN structured UV peelable PSA tape prepared in this work were similar, but the remaining adhesive on the wafer after the release of the UV cured tape was greatly reduced.
机译:本文通过聚乙二醇和异佛酮二异氰酸酯的反应制备了一种基准的异氰酸酯封端的氨基甲酸酯低聚物,聚乙二醇改性异佛尔酮二异氰酸酯低聚物(PEG-IPDI)。将其作为交联剂与丙烯酸叔酯,丙烯酸丁酯,甲基丙烯酸甲酯,丙烯酸甲酯,丙烯酸甲酯和丙烯酸组成的丙烯酸共聚物混合,以通过粘合剂中的异氰酸酯基团的反应形成网络压敏粘合剂(PSA)。用丙烯酸共聚物链中的羟基和羧基的IPDI。通过将该网络PSA与光引发剂和三官能丙烯酸单体混合,获得UV固化PSA。在将其均匀地涂覆在处理过的聚对苯二甲酸乙二醇酯膜上之后,制备用于硅晶片切割过程的UV诱导的可剥离PSA胶带。在UV照射之前形成的PSA网络与通过UV照射三官能丙烯酸酯单体产生的另一网络保持,以给出互穿网络(IPN)结构。结果表明,这种具有IPN结构的新型紫外线固化PSA胶带在紫外线照射前具有强大的剥离强度,并且可以满足硅晶片切割过程的固定要求。在UV固化后,由于IPN结构的形成,剥离强度显着降低。与用传统的多功能氨基甲酸酯丙烯酸酯低聚物制备的那些半IPN结构胶带相比,在该工作中制备的IPN结构UV可剥离PSA胶带的粘合性能相似,但晶片释放后的晶片上的剩余粘合剂磁带大大减少了。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号