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首页> 外文期刊>Progress in Organic Coatings: An International Review Journal >Enhancement of thermal conductivity in epoxy coatings through the combined addition of expanded graphite and boron nitride fillers
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Enhancement of thermal conductivity in epoxy coatings through the combined addition of expanded graphite and boron nitride fillers

机译:通过组合添加膨胀石墨和氮化硼填料的增强环氧涂层中的热导率

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摘要

Expanded graphite (EG) and boron nitride (BN) were used as fillers to impart thermal conductivity (TC) while maintaining electrical insulation of a homopolymerized cycloaliphatic epoxy matrix. Even though EG leads to a higher increase of TC than BN (550% of enhancement with only a 7.5 wt.% of EG), EG is also electroconductive and its ratio in the formulation must be lower than the percolation threshold. Formulations with proportions between 2.5-7.5 wt.% of EG as the filler and mixtures with EG and a 40 wt.% of BN were thermally polymerized and composites with 70 wt.% of BN and 2.5/5.0 wt.% of EG were also prepared under pressure and then cured in the oven. Over 2 W/m K was achieved (i.e. more than 1500% of enhancement in reference to the neat epoxy). The composites containing a 40 wt. % of BN and 2.5 wt % of EG or 70% wt. % of BN and 5 wt % of EG were found to keep the insulation character. Mechanical and thermal characteristics of the prepared materials were also evaluated.
机译:膨胀石墨(例如)和氮化硼(BN)用作填料,以赋予导热率(TC),同时保持均聚循环族环族环氧基质的电绝缘。 即使例如导致TC的较高增加而不是BN(只有7.5重量%的增强量的550%),例如也是导电性的,并且其在制剂中的比率必须低于渗透阈值。 在2.5-7.5重量%的比例之间的配方,例如作为填料的%和具有例如40重量%的混合物是热聚合的,并且具有70重量%的复合材料,Bn和2.5 / 5.0重量%的重量%也是如此 在压力下制备然后在烤箱中固化。 达到超过2W / m k(即超过1500%的增强参考整洁环氧树脂)。 含有40wt的复合材料。 Bn%的%(均为2.5wt%),例如70%wt。 发现BN的%和例如5wt%的例如,为了保留绝缘特征。 还评估了制备的材料的机械和热特性。

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