Features of Curing of a Diane Epoxy Oligomer Modified with Epoxyphosphazene

摘要

The results of rheokinetic, dynamic mechanical, and calorimetric investigations of the process of curing of an epoxy oligomer ED-20 blend with epoxyphosphazene by a low-molecular-weight polyamide L-20 are analyzed. It is shown that the phenomenological curing kinetics of all studied systems is characterized by the presence of two stages of the process: a second-order reaction followed by a self-retarded second-order reaction upon reaching the isothermal glass transition of the system.