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Modeling the thermoviscoelasticity of transversely isotropic shape memory polymer composites

机译:模拟横向各向同性形状记忆聚合物复合材料的热血压凝固性

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Shape memory polymer composites (SMPCs) are emerging smart materials of great application potential due to high deformability and good shape memory properties, with improved mechanical properties compared to pure polymers. In the paper, a micromechanical model is developed to predict the thermoviscoelastic and shape memory properties of such composite systems. First of all, we extend the Mori-Tanaka method into Carson domain based on the Correspondence Principle in viscoelasticity. Thus, the relaxation moduli of SMPCs at different temperatures can be obtained by the thermoviscoelastic properties of the matrix and the reinforcement in the transformed Carson domain. Next the inversion of the relaxation moduli from the Carson domain to the time (physical) domain is accomplished numerically by a multi-precision algorithm. Then, the three-element fractional Zener model is employed to describe the temperature-dependent relaxation modulus and the constitutive relations of SMPCs, and the analytical solutions to the partially constrained shape recovery behaviors are obtained, as well as the stress-strain relations of the material at different temperatures. The overall micromechanical model is then implemented into Mathematica, and the simulation results are compared to and agree well with the experimental results of two different kinds of SMPCs. The paper provides an efficient method on predicting the complex behaviors of transversely isotropic SMPCs.
机译:由于具有高可变形性和良好的形状记忆性能,形状记忆聚合物复合材料(SMPC)是出现良好的应用潜力的智能材料,与纯聚合物相比,改善的机械性能。在本文中,开发了一种微机械模型以预测这种复合系统的热涂层和形状记忆性能。首先,我们基于粘弹性的对应原理将森林塔卡方法扩展到卡森领域。因此,可以通过基质的热涂层性质和变换的Carson结构域中的增强物来获得不同温度下的SMPC的松弛模量。接下来,通过多精度算法在数值上以数字方式从卡森域中从卡森域中进行放松模型的反转。然后,采用三元分数齐纳模型来描述SMPC的温度依赖性的弛豫模量和组成型关系,并且获得了部分约束的形状恢复行为的分析解,以及应力 - 应变关系不同温度的材料。然后将整体微机械模型实施到Mathematica中,并将模拟结果与两种不同SMPC的实验结果相吻合。本文提供了一种有效的方法,可以预测横向各向同性SMPC的复杂行为。

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