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首页> 外文期刊>Separation and Purification Technology >Process integration of E-waste carbonization and High-gravity rotating packed bed for optimal gold recovery and the fine particles reduction
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Process integration of E-waste carbonization and High-gravity rotating packed bed for optimal gold recovery and the fine particles reduction

机译:用于最佳金回收的电子废碳化和高重旋转填充床的工艺整合,减少细粒子

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摘要

Urban mining that uses an electronic waste recycling process is an emerging industry that is used to recover several high-value precious metals to reduce natural degradation and depletion. To obtain these precious metals more effectively, integrated circuit (IC) chips are pretreated using a carbonization process. In this study, the gold stripping efficiency for various types of IC chips was evaluated. To reduce the carried fine particle emitted from the exhaust gas of the carbonization process, a high-gravity rotating packed bed (HiGee RPB) generating micromixing the gas and liquid phases under a centrifugal force was applied. The performance in terms of particle removal efficiency under different high-gravity factor and gas-to-liquid ratio was determined. The result indicated that a pyrolysis temperature of 800 degrees C gives the maximum gold stripping efficiency of 99.8% and a minimum particle concentration of 23 mg m(-3). The particle removal efficiency increased as the high-gravity factor and liquid flow rate increased. An empirical model is used to describe the particle collection mechanism based on the experiment data and control variables. The mechanism includes Brownian diffusion, inertial impaction and interception, which affect the removal efficiency for different particle sizes. Finally, the process was optimized in terms of the removal efficiency and the energy consumption using a response surface model. A minimum level of energy consumption with a particle emission concentration of 16.9 mg m(-3) is necessary for the IC chip carbonization process.
机译:使用电子废物回收过程的城市采矿是一种新兴行业,用于恢复几种高价值贵金属,以降低自然降解和消耗。为了更有效地获得这些贵金属,使用碳化过程预处理集成电路(IC)芯片。在该研究中,评估了各种IC芯片的金剥离效率。为了减少从碳化过程的废气发射的携带细颗粒,施加了在离心力下产生微混合气体和液相的高重旋转堆叠床(HIGEE RPB)。确定了在不同高重量系数和气到液比下颗粒去除效率方面的性能。结果表明,800℃的热解温度使得最大金剥离效率为99.8%,最小颗粒浓度为23mg m(-3)。随着高重力因子和液体流速的增加,颗粒去除效率增加。实证模型用于描述基于实验数据和控制变量的粒子收集机制。该机制包括布朗扩散,惯性剥夺和拦截,其影响不同粒度的去除效率。最后,根据使用响应面模型的去除效率和能量消耗来优化该过程。 IC芯片碳化过程需要颗粒发射浓度为16.9mg m(-3)的最小能耗。

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