Analytical Method of Small-Sized Module Stress Mura Based on the Finite-Element Simulation

摘要

Uneven brightness (Mura) will be observed in edge of active area (AA) which position corresponding to side of IC. This light leakage phenomenon is due to thermal stress after COG bonding. Discussing the mechanism and defining a method to evaluate quantitatively. It can be extended to study other stress Mura.