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Experimental analysis and mechanical modeling of effect of stress-relaxation on shape memory and recovery behavior of e-beam irradiated HDPE

机译:应力松弛对电子束照射HDPE形状记忆和恢复行为影响的实验分析与机械建模

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The thermo-sensitive shape memory behavior of electron beam crosslinked high-density polyethylene (EB-XL-HDPE) was analyzed in terms of effects of processing variables (dose, stretch ratio and programming temperature) on the recovery behavior of the EB-XL-HDPE. Shape memory induced above the melting temperature revealed an instant recovery with higher initial recovery temperature as compared to the samples programmed at crystallization temperature, well correlated with the observed differences in their crystallite size, crystal orientation and degree of crystallinity analyzed by wide-angle X-ray scattering (WAXS). The WAXS on orientation of crystalline domains in the stretched specimens confirmed breakdown of crystallites and formation of an uneven crystallite size as a result of stretching of specimens in the semi-crystalline state below melting temperature. With the increase in programming temperature, the relative orientation of stretched EB-XL-HDPE is increased due to greater flow of the plastic phase, thus enhancing the recoverability. A four-element mechanical model was developed to simulate and predict recoverability and stress relaxation behavior of the shape memory EB-XL-HDPE. By adjusting model parameters, the model described precisely the experimentally measured shape memory behavior of EB-XL-HDPE and predicted its recovery behavior. It is concluded that the stress relaxation phenomenon is accountable for partial recovery of the EB-XL-HDPE remained under sustained stress.
机译:电子束交联高密度聚乙烯(EB-XL-HDPE)的热敏形状记忆行为在加工变量(剂量,拉伸比率和编程温度)对EB-XL的恢复行为的影响方面分析HDPE。与在结晶温度下编程的样品相比,熔化温度诱导熔融温度的形状记忆显示,与在结晶温度下进行的样品相比,初始恢复温度较高,与通过广角X-分析的晶状体尺寸,晶体取向和结晶度的晶体度差异良好相关。射线散射(蜡)。在拉伸试样中的结晶结构域取向的蜡确认了微晶的击穿和形成不均匀的微晶尺寸,因为在熔化温度以下的半结晶状态下拉伸试样。随着编程温度的增加,由于塑性相的较大流动,拉伸EB-XL-HDPE的相对取向增加,从而提高了可回收性。开发了四元件机械模型以模拟和预测形状记忆EB-XL-HDPE的可恢复性和应力松弛行为。通过调整模型参数,模型精确地描述了EB-XL-HDPE的实验测量的形状记忆行为,并预测其恢复行为。得出结论,应力松弛现象是对持续压力仍然存在的EB-XL-HDPE的部分恢复负责。

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