机译:铝芯片固态回收综述
South China Univ Technol Guangdong Key Lab Adv Metall Mat Proc Guangzhou 510640 Guangdong Peoples R China;
South China Univ Technol Guangdong Key Lab Adv Metall Mat Proc Guangzhou 510640 Guangdong Peoples R China;
South China Univ Technol Guangdong Key Lab Adv Metall Mat Proc Guangzhou 510640 Guangdong Peoples R China;
South China Univ Technol Guangdong Key Lab Adv Metall Mat Proc Guangzhou 510640 Guangdong Peoples R China;
South China Univ Technol Guangdong Key Lab Adv Metall Mat Proc Guangzhou 510640 Guangdong Peoples R China;
South China Univ Technol Guangdong Key Lab Adv Metall Mat Proc Guangzhou 510640 Guangdong Peoples R China;
Aluminum chips; Solid state recycling; Consolidation; Microstructure;
机译:铝芯片固态回收综述
机译:摩擦回注挤压工艺对AA1090铝合金切片的新型可持续直接固态回收
机译:铝芯片固态回收中的焊接强度
机译:挤出比和材料流动对6060铝合金芯片再循环的铝型材固态的机械性能
机译:优化压铸铝A380加工屑的回收工艺。
机译:基于计算机断层摄影技术的再生AW6060铝芯片挤压型材的疲劳行为和损伤发展的表征
机译:挤出温度对固态再循环铝合金氯化钠溶液腐蚀行为的影响6061芯片
机译:铝:反光铝芯片