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Review of solid state recycling of aluminum chips

机译:铝芯片固态回收综述

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摘要

In contrast with the conventional remelting recycling of aluminum and its alloy chips, the solid state recycling techniques, which can convert the chips directly into dense bulk materials, have attracted significant attention primarily because it possesses many advantages including lower energy consumption, lower metal loss as well as almost no emissions of harmful gases and solid wasters. In this keynote paper, with a view to the current researches of the solid state recycling techniques based on the severe plastic deformation (SPD) and powder metallurgy (P/M), the characteristics and applications of several typical methods, such as hot extrusion, equal channel angular pressing (ECAP), cyclic extrusion compression (CEC), friction stir extrusion (FSE), high pressure torsion (HPT), screw extrusion and spark plasma sintering (SPS), are introduced. A growing number of researches and literatures suggest that the mechanical properties of solid state recycled specimens are primarily dependent on the chip bonding quality and microstructure of the corresponding bulk materials. Then, the mechanism analysis of consolidation of chips is carried out, and three relevant theoretical modes, characterizing the bonding quality, are also mentioned. Moreover, the factors influencing the density and microstructure of chip consolidated product are discussed comprehensively. Eventually, recommendations in the improvement of solid state recycling techniques and the future prospects are put forward.
机译:与铝及其合金芯片的常规重熔再循环相比,可以将芯片直接转化为致密散装材料的固态回收技术引起了显着的关注,因为它具有较低的能耗,降低金属损失以及几乎没有有害气体和固体浪费的排放。在这篇主题纸上,目前基于严重的塑性变形(SPD)和粉末冶金(P / M)的固态回收技术的当前研究,几种典型方法的特点和应用,如热挤压,介绍了循环角压(ECAP),循环挤压压缩(CEC),摩擦搅拌挤出(FSE),高压扭转(HPT),螺旋挤压和火花等离子体烧结(SPS)。越来越多的研究和文献表明固态再循环试样的机械性能主要取决于相应散装材料的芯片键合质量和微观结构。然后,还提到了芯片固结的机制分析,并提到了三种相关的理论模式,表征粘合品质。此外,全面地讨论了影响芯片固结产品密度和微观结构的因素。最终,提出了改善固态回收技术和未来前景的建议。

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