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Molecular dynamics simulations of AlN deposition on GaN substrate

机译:GaN衬底上ALN沉积的分子动力学模拟

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In this work, we investigated the deposition of AlN film on GaN substrate by using molecular dynamics (MD) simulations. The effects of GaN substrate surface, growth temperature, and injected N: Al flux ratio on the growth of AlN film were simulated and studied. Consequently, the deposited AlN film on the (0001) Ga-terminated GaN surface achieves better surface morphology and crystallinity than that on the (000-1) N-terminated GaN surface due to the different diffusion ability of Al and N adatoms on two GaN surfaces. Furthermore, with the increase of growth temperature, the surface morphology and crystallinity of AlN film were improved owing to the enhanced mobility of adatoms. At the optimised injected N: Al flux ratio of 1, comparatively good surface morphology and crystallinity of deposited AlN films were realised. This method lays a foundation for the follow-up real-time study of defects and stress evolution of AlN on GaN and can be applied to film growth of other materials.
机译:在这项工作中,我们通过使用分子动力学(MD)模拟来研究Aln膜对GaN底物的沉积。 模拟并研究了GaN底物表面,生长温度和注射N:Al助熔剂的效果N:Al通量比。 因此,在(0001)Ga封端的GaN表面上的沉积AlN膜实现了更好的表面形态和结晶性,而不是在两个GaN上的Al和N个吸附物的不同扩散能力上的(000-1)N-终止的GaN表面上 表面。 此外,随着生长温度的增加,由于增强的脱脂剂的迁移率,通过增强的AlN膜的表面形态和结晶度。 在优化的注射N:Al通量比为1,实现沉积的AlN膜的相对良好的表面形态和结晶度。 该方法为GaN上ALN的缺陷和应力演化进行后续实时研究,可以应用于其他材料的薄膜生长。

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