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Advances in test and measurement of the interface adhesion and bond strengths in coating-substrate systems, emphasising blister and bulk techniques

机译:涂层基板系统界面粘附和粘合强度的测试和测量的研究进展,强调泡罩和散装技术

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摘要

In this paper, recent advances in the minimum-destructive testing of the adhesion of coating-substrate systems are reviewed, focusing on key techniques such as micro-and nano-scale levels of indentation, scratching, laser-induced wave shock, as well as the blister and buckle approach. Along with adhesion failure tests, the latest and most extensive applications of the adhesion test methods in nano-, micro- and bulk-coating technology and the associated techniques to determine the minimum damage defects left on the coatings are discussed and their use reviewed. (C) 2019 Published by Elsevier Ltd.
机译:在本文中,综述了涂层衬底系统粘附性的最小破坏性测试的最新进展,重点关注微型和纳米级压痕,刮擦,激光诱导波震动的关键技术,以及 泡罩和扣边的方法。 随着粘附性衰竭试验,讨论了纳米,微涂层技术的最新和最广泛的粘合试验方法以及相关技术,以确定涂层上留在涂层上的最小损伤缺陷的缺陷。 (c)2019年由elestvier有限公司出版

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