ULTRASONIC THIN-FILM TESTING: A laser ultrasonic testing method rapidly determines many physical properties of thin films nondestructively

摘要

A nondestructive, laser-based method for thin-film analysis based on surface acoustic waves has been developed after ten years of research by the Fraunhofer Institute in Germany. This research has culminated in an instrument that can measure thickness, hardness, elastic modulus, and Poisson's ratio of thin films. It is also effective for detecting adherence (de-lamination) and coherence problems of thin films. This instrument, called the LAwave (Laser Acoustic wave), can generate all of these physical measurements in only three to four minutes of analysis time.