Milling to tight tolerances: Specialist saw manufacturer brings machining in-house and achieves ±5μm on straightness and flatness

摘要

More than 40 years ago, Cricklade-based Loadpoint Micro-Machining Solutions developed what became the industrystandard saw for dicing semiconductor wafers. Sawing avoids the current leakage in electronic components caused by the old method of scribing and snapping wafers.