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首页> 外文期刊>Machining Science and Technology >Comparative analysis of chipping mechanics of float glass during rotary ultrasonic drilling and conventional drilling: For multi-shaped tools
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Comparative analysis of chipping mechanics of float glass during rotary ultrasonic drilling and conventional drilling: For multi-shaped tools

机译:旋转超声钻孔过程中浮法玻璃切削力学的比较分析及常规钻孔:多重工具

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Float glass has immense applications such as sensor glass, micro-processor glass and decorative glass; because of its exceptional wear resistance, chemical and thermal characteristics. Nevertheless, researchers are still bearing decisive issues, which affect its application. These issues are profile inaccuracy and chipping because of its poor machining characteristics and hence high precision machining. The objective of the present study is to condemn the chipping related hindrances while using multi-shaped diamond abrasive tools to create blind holes. The tools, which applied, are named as hollow abrasive tool, pinpointed conical tool, flat cylindrical tools and concave circular tool. The experimental trials were performed by rotary ultrasonic drilling (RUD) and CNC conventional drilling (CD). The actual industrial conditions and parameters were considered throughout the experimentation. Physics behind the formation of chipping on hole periphery by RUD and CD are revealed. In addition, individual mechanisms of multi-shape tools with respect to chipping are analyzed. The results show that RUD process has attained the smallest measurement of chip radial distance as compared to CD for all types of tool. Finally, the concave circular tool is found as the best tool particularly to get least chip radial distance during drilling i.e. 0.1145 mm.
机译:浮法玻璃具有巨大的应用,如传感器玻璃,微处理器玻璃和装饰玻璃;由于其具有卓越的耐磨性,化学和热特性。尽管如此,研究人员仍然承担了果断的问题,影响其应用。这些问题是个人资料不准确和切屑,因为其加工特性差,因此高精度加工。本研究的目的是在使用多形金刚石磨料工具产生盲孔的同时谴责碎裂相关的障碍。应用的工具被命名为空心磨料工具,精确定位的锥形工具,扁平圆柱形工具和凹形圆形工具。通过旋转超声钻孔(RUD)和CNC常规钻孔(CD)进行实验试验。在整个实验中考虑了实际的工业条件和参数。揭示了RUD和CD孔周边形成的物理学背后的物理。此外,分析了多形工具相对于碎裂的各个机制。结果表明,与所有类型的工具相比,RUD进程达到了芯片径向距离的最小测量。最后,发现凹形圆形工具作为最佳工具,特别是在钻孔期间收到最少的芯片径向距离。

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