首页> 外文期刊>Food and Bioproducts Processing. Transactions of the Institution of Chemical Engineers, Part C >Influence of three different drying techniques on persimmon chips' characteristics: A comparison study among hot-air, combined hot-air-microwave, and vacuum-freeze drying techniques
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Influence of three different drying techniques on persimmon chips' characteristics: A comparison study among hot-air, combined hot-air-microwave, and vacuum-freeze drying techniques

机译:三种不同干燥技术对柿子芯片特性的影响:热空气,综合热空气微波和真空冷冻干燥技术的比较研究

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The effect of three different drying methods (hot-air, combined hot-air-microwave, and vacuum-freeze) on the sensorial, textural, nutritional, and other quality characteristics of persimmon chips was compared. The result showed that the freeze-dried chips had the best nutritional and quality features. However, persimmon chips processed by combined hot-air-microwave and freeze-techniques had the same sensory score (85.40 points), which were higher than that of hot-air dried samples (70.51 points). Additionally, persimmon chips dried with aid of hot-air technique had the lowest chewability value and hardly met the panelists' requirements. These disadvantages could be avoided by using a combined hotair-microwave drying method with lower power consumption compared with the others. The optimized combining microwave and hot-air drying conditions were as follows: 1 mm thickness of persimmon slice, a temperature of 70 degrees C at an air velocity of 1.0 m/s of initial hot-air drying system until the moisture content of persimmon samples reached 10% (about 150-160 min) and 10.7 Wg(-1) of the following microwave-drying system. It was concluded that the combined hot-air-microwave drying technique could be used for processing persimmon chips with high quality and nutritional values as well as low operating costs. (C) 2019 Institution of Chemical Engineers. Published by Elsevier B.V. All rights reserved.
机译:比较了三种不同的干燥方法(热空气,综合热空气微波和真空冻结)对柿子芯片的感觉,纹理,营养和其他品质特征的影响。结果表明,冷冻干燥的芯片具有最佳的营养和质量特征。然而,由组合的热空气微波和冷冻技术加工的柿子芯片具有相同的感觉分数(85.40点),其高于热风干燥样品(70.51点)。另外,借助热空气技术干燥的柿子芯片具有最低的芯合值,并且几乎不符合小组成员的要求。通过使用具有较低功耗与其他缺点的组合的热门微波干燥方法可以避免这些缺点。优化的组合微波和热风干燥条件如下:1mm厚度的柿子片,在初始热风干燥系统的空气速度为1.0m / s的空气速度,直至柿子样品的水分含量为70摄氏度达到以下微波干燥系统的10%(约150-160分钟)和10.7Wg(-1)。得出结论是,综合的热空气微波干燥技术可用于处理具有高质量和营养价值的柿子芯片以及低运营成本。 (c)2019化学工程师机构。 elsevier b.v出版。保留所有权利。

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