Two-Dimensional Mapping of In-plane Residual Stress with Slitting

摘要

This paper describes the use of slitting to form a two-dimensional spatial map of one component of residual stress in the plane of a two-dimensional body. Slitting is a residual stress measurement technique that incrementally cuts a thin slit along a plane across a body, while measuring strain at a remote location as a function of slit depth. Data reduction, based on elastic deformation, provides the residual stress component normal to the plane as a function of position along the slit depth. While a single slitting measurement provides residual stress along a single plane, the new work postulates that multiple measurements on adjacent planes can form a two-dimensional spatial map of residual stress. The paper uses numerical simulations to develop knowledge of two fundamental problems regarding two-dimensional mapping with slitting. The first fundamental problem is to estimate the quality of a slitting measurement, relative to the proximity of a given measurement plane to a free surface, whether that surface is the edge of the original part or a free surface created by a prior measurement. The second fundamental problem is to quantify the effects of a prior slitting measurement on a subsequent measurement, which is affected by the physical separation of the measurement planes. The results of the numerical simulations lead to a recommended measurement design for mapping residual stress. Finally, the numerical work and recommended measurement strategy are validated with physical experiments using thin aluminum slices containing residual stress induced by quenching. The physical experiments show that two-dimensional residual stress mapping with slitting, under good experimental conditions (simple sample geometry and low modulus material), has precision on the order of 10 MPa. Additional validation measurements, performed with x-ray diffraction and ESPI hole drilling, are within 10 to 20 MPa of the results from slitting.