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首页> 外文期刊>ECS Journal of Solid State Science and Technology >Enhanced Photovoltaic Characteristics of Screen-Printed Monocrystalline Silicon Solar Cells by Rear Electroplated Copper
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Enhanced Photovoltaic Characteristics of Screen-Printed Monocrystalline Silicon Solar Cells by Rear Electroplated Copper

机译:通过后电镀铜增强丝网印刷单晶硅太阳能电池的光伏特性

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摘要

Improved photovoltaic characteristics for screen-printed monocrystalline silicon solar cells (SPSSCs) were demonstrated by electroplated copper (EPC) as the rear metallization. The Al back-surface-field (Al-BSF) formed by screen-printed (SP) Al paste was prepared as a seed layer for the EPC. The EPC parameters, including the current density, electroplating time, buffered-oxide-etch (BOE), and mixed HF/HNO3/H2O pretreatments, were investigated. The experimental results indicate that the relatively higher intensity from the Cu (111) plane and the Cu (200) plane was demonstrated to be approximately 2.2 for the EPC at a current density of 25 mA/cm(2). Excellent adhesion of up to 2.4 N/mm was demonstrated. The achievement of a conversion efficiency (CE) improvement of more than 1.8%, from 15.4% to 17.2% for SPSSCs with EPC as the rear contact, was determined. The enhancement could be attributed to the reduction of the series resistance (SR) and an increase in the adhesion between the Al-BSF and EPC. (C) 2017 The Electrochemical Society. All rights reserved.
机译:通过电镀铜(EPC)作为后金属化证明了用于丝网印刷单晶硅太阳能电池(SPSSCs)的改进的光伏特性。通过丝网印刷(SP)Al浆料形成的Al背面场(Al-BSF)作为EPC的种子层制备。研究了EPC参数,包括电流密度,电镀时间,缓冲氧化物蚀刻(BOE)和混合的HF / HNO3 / H2O预处理。实验结果表明,来自Cu(111)平面的相对较高的强度和Cu(200)平面的强度在25mA / cm(2)的电流密度下为EPC约2.2。对高达2.4N / mm的优异粘合性得到了证明。确定了转换效率(CE)的转化效率(CE)的提高超过1.8%,从EPC为后接触的SPCSSSCS的15.4%至17.2%。增强可归因于串联电阻(SR)的降低和Al-BSF和EPC之间的粘附性的增加。 (c)2017年电化学协会。版权所有。

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