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首页> 外文期刊>Advanced Science Letters >An Innovated Wireless RFID-Based Non-Floating Type Thermal Bubble Accelerometer on a Flexible Substrate
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An Innovated Wireless RFID-Based Non-Floating Type Thermal Bubble Accelerometer on a Flexible Substrate

机译:基于柔性RFID的创新无线非浮型热气泡加速度计

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This paper proposes an innovated method to integrate an active RFID tag with a thermal bubble accelerometer on a flexible substrate, e.g., PT, PET and PI, thus it can become a wireless acceleration sensor for easy usage and power saving in sports, hospital monitoring, air bag, game, navigation, exercising, etc. Because the thermal conductivity of the traditional Si is 1.48 W/(cm-K), which is about 25 times of the proposed flexible substrate, i.e., 0.06-0.0017 VW(cm-K), thus the power leakage through the substrate can be saved. In this paper the heaters and the temperature sensors are deposited by E-gun evaporator on the surface of the flexible substrate without the traditional floating structures over a grooved chamber. Thus the new device is much simpler and cheaper. It is also more reliable in large acceleration impact condition without breaking the heaters and the temperature sensors hanging over the grooved chamber. In addition, the internal rectangular shape of the device chamber is replaced by a semi-cylindrical one to speed up the gas flow for heat convection. Moreover, the molecular weight of the proposed filling xenon gas (131.29 g/mol) is three times larger than the commercial one with CO_2 (44.01 g/mol), thus both sensitivity and response speed can be increased. Comparisons of step-input acceleration commend are made; the performances of sensitivity and kinetic energy response time for the proposed semi-cylindrical chamber filled with xenon gas are better than the previous rectangular one by 15% and 43.2%, respectively.
机译:本文提出了一种创新的方法,可以将有源RFID标签与热气泡加速度计集成在柔性基板(例如PT,PET和PI)上,从而使其成为一种无线加速度传感器,在体育,医院监控,气囊,游戏,导航,锻炼等。因为传统Si的热导率为1.48 W /(cm-K),约为所建议的柔性基板的25倍,即0.06-0.0017 VW(cm-K) ),因此可以节省通过基板的功率泄漏。在本文中,加热器和温度传感器通过E-gun蒸发器沉积在柔性基板的表面上,而没有传统的浮动结构在开槽腔室上。因此,新设备更加简单和便宜。在较大的加速度冲击条件下,它也更可靠,而不会损坏加热器和悬挂在带槽腔室上方的温度传感器。另外,装置腔室的内部矩形形状被半圆柱形的形状代替,以加快用于热对流的气流。此外,所提出的填充氙气的分子量(131.29 g / mol)比市售含CO_2的氙气(44.01 g / mol)大三倍,因此可以提高灵敏度和响应速度。对步进输入加速度的推荐值进行了比较;建议的氙气填充的半圆柱形腔室的灵敏度和动能响应时间性能分别比以前的矩形腔室高15%和43.2%。

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