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Shear band multiplication induced strong strain delocalization and high tensile ductility in amorphous thin films by metallic substrates

机译:剪切带倍增诱导金属基材在无定形薄膜中强应变分层和高拉伸延展性

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Metallic glass usually ruptures at a small strain by forming single dominant shear band under tension at room temperature. Experiments have shown that multiple shear bands can be induced in metallic glass film by a ductile metallic substrate, and the ductility of the film can be elevated significantly. However, the mechanism behind remains unsolved. Here we established a computational model to investigate the effect of a Ni substrate on the deformation of a Ni-P amorphous film. The shear band evolution in the film was described by a free volume-based constitutive theory, while the deformation of the Ni substrate was simulated by a dislocation density-based model. The film/substrate interface was modeled by a cohesive zone law. In the simulations, the shear band evolution and the stress in the film can be measured directly, which is difficult to achieve in experiments. Our simulations show that multiple shear bands have been formed in the substrate-supported metallic glass film if the film thickness h f is less than 10 mu m. The thinner the film is, the more the shear bands the film has. The number of shear bands can reach as high as 16 as h f is refined down to 2.5 mu m. The generation of the multiple shear bands alleviated the strong strain-softening as observed in free standing film, as clearly shown in the stress-strain response of the thin film in the film/substrate system. The suppressed strain-softening induces significantly enhanced tensile ductility in the amorphous film. The tensile ductility of the 2.5 mu m-thick film on the Ni substrate can reach as high as 13.3%, which is much higher than that of the corresponding freestanding film, i.e., 3.1%. The proposed computational model has been validated by the coincident stress-strain responses between simulations and experiments. The findings revealed that the enhanced tensile ductility originates from the shear band multiplication-induced strain delocalization in the amorphous film due to the constraint of the metallic substrate. (C) 2020 Elsevier Ltd. All rights reserved.
机译:金属玻璃通常通过在室温下形成单一主导剪切带来破裂小菌株。实验表明,通过延性金属基板可以在金属玻璃膜中诱导多个剪切带,并且可以显着升高膜的延展性。但是,后面的机制仍未解决。在这里,我们建立了计算模型,以研究Ni衬底对Ni-P非晶膜的变形的影响。通过基于自由体积的本构体理论描述膜中的剪切带进化,而Ni衬底的变形是通过位错密度的模型模拟的。薄膜/底物界面由粘性区法建模。在模拟中,可以直接测量剪切带进化和膜中的应力,这难以在实验中实现。我们的模拟表明,如果膜厚度H F小于10μm,则在基板支撑的金属玻璃膜中形成了多个剪切带。薄膜的薄膜较薄,薄膜的剪切带越多。剪切带的数量可以高达16,因为H F精制到2.5 mu m。多剪切带的产生减轻了在自由脱膜中观察到的强应变软化,如薄膜/基板系统中薄膜的应力 - 应变响应清楚地示出。抑制的应变软化诱导非晶膜中的显着增强的拉伸延展性。 Ni底物上的2.5μm厚膜的拉伸延展性可达高达13.3%,远高于相应的独立膜的薄膜,即3.1%。通过模拟和实验之间的重合应力 - 应变响应验证了所提出的计算模型。结果表明,由于金属基材的约束,增强的拉伸延展性来自非晶膜中的剪切带倍增诱导的应变分层化。 (c)2020 elestvier有限公司保留所有权利。

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