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Performance analysis and shape optimization of a water-cooled impingement micro-channel heat sink including manifolds

机译:水冷冲击微通道散热器的性能分析和形状优化,包括歧管

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Impingement micro-channel heat sinks are in general preferred over parallel flow micro-channel heat sinks owing to the reduced pressure drop. Splitting the flow in two branches cuts the flow rate and path in half, which leads to lower pressure drop through the channels in impingement heat sinks compared to a parallel flow heat sink. A numerical model was developed to predict the heat sink performance. Because of the significant effect that inlet and outlet manifolds (distributor and collector) have on the heat sink hydraulic and thermal performance, the numerical model includes them. The model was validated both for hydraulic and thermal performance using experimental data. The model was used for shape optimization of the heat sink in constant chip power, coolant inlet temperature and flow rate as well distributor and collector geometry. A parametric study was performed to estimate the effect of the geometric design parameters on the hydraulic and thermal resistances as the response parameters. The chip-base interface temperature profile was very different from typical parallel heat sinks. The coefficient of performance as a measure of the heat sink overall performance (hydraulic and thermal) was measured experimentally. Furthermore, the sensitivity of the heat sink coefficient of performance to chip power, coolant inlet temperature and flow rate was estimated using a regression model fitted on the obtained experimental result.
机译:由于减压降,冲击微通道散热器通常优于平行流动微通道散热器。与平行流动散热器相比,将流速和路径分成一半的流速和路径,这导致通过冲击散热器中的通道降低压力。开发了一种数值模型来预测散热器性能。由于入口和出口歧管(分配器和集电极)对散热器液压和热性能的显着影响,数值模型包括它们。使用实验数据验证该模型的液压和热性能。该模型用于恒芯片功率,冷却剂入口温度和流量的散热器的形状优化,以及分配器几何形状。执行参数研究以估计几何设计参数对液压和热电阻的影响作为响应参数。芯片基部接口温度曲线与典型的平行散热器非常不同。实验测量了作为散热器总体性能(液压和热)的量度的性能系数。此外,使用安装在所获得的实验结果上的回归模型估计了对芯片功率,冷却剂入口温度和流速的散热器系数的灵敏度。

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