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Modeling the thermo-mechanical behavior and constrained recovery performance of cold-programmed amorphous shape-memory polymers

机译:采用冷编无定形形状记忆聚合物的热力学行为和约束恢复性能

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摘要

The low recovery stress has limited utilizing shape-memory polymers (SMPs) as actuators. In this work, we demonstrate that the resultant recovery stress of amorphous SMPs can be significantly increased through cold programming. A three-dimensional model is formulated to describe the thermo-mechanical behavior and shape-memory performance of amorphous polymers in large deformation. The constitutive relationship is derived based on the two-temperature thermodynamic framework employing an effective temperature as a thermodynamic state variable to describe the nonequilibrium structure of amorphous polymers. The model also incorporates the molecular orientation with a relaxation mechanism to describe strain hardening. The model is applied to simulate the stress-strain relationship and stress relaxation behaviors of an amorphous SMP in the programming process and the stress response in the constrained recovery process. The model can accurately reproduce the measured stress response at different temperatures and loading rates. Both experimental and simulation results show that polymers deformed at a larger loading rate exhibit a lower stress in the holding period, though simulation pronouncedly underestimates the magnitude of stress drop in the stress relaxation process. The model also captures the magnitude and location of the peak stress during the constrained recovery process for SMPs programmed at different temperatures and with different applied strains.
机译:低收回应力利用形状记忆聚合物(SMPS)作为致动器的限制。在这项工作中,我们证明通过冷编程可以显着提高非晶SMP的恢复应力。配制三维模型以描述大变形中无定形聚合物的热机械行为和形状记忆性能。基于采用有效温度作为热力学状态变量的两个温度热力学框架来导出本构关系关系,以描述非晶态聚合物的非预测结构。该模型还将分子取向含有弛豫机制来描述应变硬化。应用该模型来模拟编程过程中无定形SMP的应力 - 应变关系和应力松弛行为和受约束恢复过程中的应力响应。该模型可以在不同温度和装载速率下精确地再现测量的应力响应。实验和仿真结果表明,在较大的加载速率下变形的聚合物在保持时段中表现出较低的应力,但模拟发音下低估了应力松弛过程中应力下降的幅度。该模型还捕获在不同温度和不同施加的菌株上编程的SMPS期间峰值应力期间峰值应力的幅度和位置。

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