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首页> 外文期刊>International Journal of Plasticity >Interactive effect of stress state and grain size on fracture behaviours of copper in micro-scaled plastic deformation
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Interactive effect of stress state and grain size on fracture behaviours of copper in micro-scaled plastic deformation

机译:压力状态和晶粒尺寸对微观塑性变形铜断裂行为的互动效果

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摘要

To explore the interactive influence of the deformation stress state and material microstructural grain size on the fracture behaviour in micro-scaled deformation, a series of micro-scale copper specimens of various geometrical dimensions and microstructural grain sizes are prepared and deformed to achieve various stress states represented by stress-related variables, such as the normalised third deviatoric stress invariant and the stress triaxiality. The speckle pattern method of continuous tracking is used to investigate the mechanical responses of materials in various deformation stress states and material microstructures, and a finite-element simulation of each deformation is conducted with the combined surface layer and grain boundary strengthening constitutive model, which considers the contributions of the surface grain, grain interior and grain boundary in representing the grain and geometry sizes. The interactive effects of the normalised third invariant, stress triaxiality and microstructural grain size on the fracture strain are identified and established by accounting for the correlation between the results of simulation and those of physical experimentation. Their influences on the fracture mechanism, mode and behaviour are further explored. The results reveal that greater stress decreases the fracture strain in the tensile deformation of round bar and cylindrical compression and increases the fracture strain in sheet shear and tensile deformations. The larger grain size generates fewer micro-voids, more uneven grain distribution and severer localisation deformation, which accelerates failure. Furthermore, stress triaxiality and the normalised third invariant at a low stress triaxiality are decreased with the increase of grain size, which in turn affects the occurrence of fracture. These effects coexist and compete with each other. In view of these influences, a larger grain size and a higher stress state inhibit the occurrence of fracture for sheet spe
机译:为了探索变形应力状态和材料微观结构粒度对微缩放变形的断裂行为的交互式影响,制备了一系列各种几何尺寸和微观结构晶粒尺寸的一系列微观铜标本,并变形以实现各种应力状态由与压力相关的变量表示,例如标准化的第三偏离偏离应力不变和应力三轴性。连续跟踪的散斑图案方法用于研究各种变形应力状态和材料微观结构中材料的机械响应,并且通过组合表面层和晶界强化本构模型进行各变形的有限元模拟,这是考虑的表面粒,谷物内部和晶界代表晶粒和几何尺寸的贡献。通过算用于模拟结果与物理实验结果与物理实验结果之间的相关性来确定归一化第三不变性,应激三轴性和微观结构粒度和微观结构粒度的互动效果。进一步探索了它们对裂缝机制,模式和行为的影响。结果表明,更大的应力降低了圆形杆和圆柱形压缩的拉伸变形中的断裂应变,并增加了片材剪切和拉伸变形中的断裂菌株。较大的晶粒尺寸会产生更少的微空隙,更不均匀的晶粒分布和严重的定位变形,这加速了失败。此外,随着晶粒尺寸的增加,应激三轴性和低应力三轴的归一化第三不变性降低,晶粒尺寸又会影响骨折的发生。这些效果共存并相互竞争。鉴于这些影响,较大的粒度和更高的应力状态抑制了片材SPE骨折的发生

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