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首页> 外文期刊>International Journal of Mechanical Sciences >A comprehensive investigation of surface generation and material removal characteristics in ultrasonic vibration assisted grinding
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A comprehensive investigation of surface generation and material removal characteristics in ultrasonic vibration assisted grinding

机译:超声波振动辅助研磨中表面发电和材料去除特性的全面研究

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摘要

Ultrasonic vibration assisted grinding (UVAG) has been proved to be superior in improved machining quality and reduced surface roughness compared with conventional grinding (CG), but its mechanism is still in constant research and understanding. Except for the imposed axial vibration, another much smaller radial vibration is generated due to Poisson effect at the same time, which has different effect on the surface generation. In this paper, a comprehensive simulation model of UVAG considering Poisson effect has been developed to predict the three-dimensional surface topography and calculate the parameters (undeformed chip thickness, dynamic active grain number) which could reflect the characteristics of corresponding material removal process. The comparison between experimental results and simulated results shows that the method proposed in this paper is in good agreement with the experimental results. The imposed axial vibration can increase dynamic active grain number, generate uniform undeformed chip thickness and reduce the surface roughness, while the additional radial vibration causes the fluctuation of undeformed chip thickness and the increase of surface roughness. The proposed simulation model of UVAG provides a new approach to the prediction of the ultrasonic surface topography and understanding of material removal process as well as the optimization of the UVAG.
机译:与传统研磨(CG)相比,超声波振动辅助研磨(UVAG)的加工质量和表面粗糙度降低,但其机制仍处于持续的研究和理解。除了施加的轴向振动外,在同一时间的同时由于泊松效果而产生另一个更小的径向振动,这对表面产生具有不同的影响。在本文中,已经开发了一种考虑泊松效应的UVAG的综合仿真模型,以预测三维表面形貌并计算可以反映相应材料去除过程的特性的参数(未变形芯片厚度,动态有源晶粒数)。实验结果和模拟结果之间的比较表明,本文提出的方法与实验结果吻合良好。施加的轴向振动可以增加动态的活性粒度,产生均匀的未变形芯片厚度并降低表面粗糙度,而额外的径向振动会导致未变形芯片厚度的波动和表面粗糙度的增加。 UVAG所提出的仿真模型提供了一种新方法来预测超声波表面地形和对材料去除过程的理解以及UVAG的优化。

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