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Molecular dynamics simulations on shock response and spalling behaviors of semi-coherent {111} Cu-Al multilayers

机译:关于半相干{111}多层的冲击响应和剥落行为的分子动力学模拟

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Shock response and spalling behaviors of semi-coherent {111} Cu-Al multilayer are investigated by molecular dynamics simulations. Firstly, the influences of interfaces on shock wave propagation are studied. The simulations show that reflection-unloading happens when the shock wave propagates from Cu to Al and reflection-loading occurs when the shock wave propagates from Al to Cu. Strong discontinuities of stress components at the interfaces are revealed as well, the discontinuities are correlated to mismatches of Hugoniot curves and elastic-plastic properties of the two materials adjacent to the interfaces. Secondly, shock induced dislocation activities are studied. It is found that the stress barrier offered by the interface Cu-Al is smaller than that offered by Al-Cu. In fact, the resistance for dislocations to transmit through interfaces is determined by the coherency stresses, Koehler stresses and misfit dislocations at the interface. In addition, spalling fracture of Cu-Al multilayers after stress wave reflection at the free surface is studied. It is observed that ductile damage only nucleates in Al layer, rather than in Cu layers. This observation agrees well with the experimental results of Han (Acta Mater., 2014 (63) 150-161). Due to complex reflection and transmission of the stress waves at the interfaces, the profile of the free surface velocity histories of the multilayer target is quite different from that of the single-crystalline counterpart. In order to study thermal dissipation process during cavitation, analysis on thermal dissipation in the spalling damage zones is also provided in this paper. Moreover, contour plots and profiles of stress are illustrated to understand the spallation process of the multilayer target deeply. Tensile stress emerges in Al-1 layer first, causing voids to nucleate; then the tensile stress wave attenuates rapidly and propagates to Cu-1 and Cu-2 layers. With the dissipation effect of damage and plastic deformation in the target, the tensile stress wave dissipates ultimately.
机译:通过分子动力学模拟研究了半相干{111} CU-AL多层多层的冲击响应和剥落行为。首先,研究了界面对冲击波传播的影响。模拟表明,当冲击波从Cu到Al传播时,发生反射卸载,并且当冲击波从Al到Cu传播时发生反射加载。揭示了界面处应力成分的强不连续性,不连续性与邻近界面相邻的两种材料的Hugoniot曲线和弹性塑料性能的不匹配相关。其次,研究了休克诱导的位错活动。发现界面Cu-Al提供的应力屏障小于Al-Cu提供的应力屏障。实际上,通过接口传输的脱位的阻力由界面处的一致应力,koehler应力和错配脱位决定。另外,研究了在自由表面处的应力波反射后剥落Cu-Al多层的骨折。观察到延性损伤仅在Al层中成核,而不是在Cu层中。这种观察结果与汉族的实验结果一致(Acta Mater。,2014(63)150-161)。由于界面处的应力波的复杂反射和传输,多层目标的自由表面速度历史的轮廓与单晶对应物的自由表面速度历史的曲线完全不同。为了在空化过程中研究热耗散过程,本文还提供了剥落损伤区的热耗散分析。此外,示出了压力的轮廓图和轮廓,以深深地理解多层目标的倒立过程。首先在Al-1层中出现拉伸应力,导致空隙成核;然后,拉伸应力波快速衰减并传播至Cu-1和Cu-2层。随着损伤和塑性变形在目标中的耗散效果,拉伸应力波最终耗散。

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