首页> 外文期刊>International Journal of Mechanical Sciences >Intensity of singular stress fields (ISSFs) in micro-bond test in comparison with ISSFs in pull-out test
【24h】

Intensity of singular stress fields (ISSFs) in micro-bond test in comparison with ISSFs in pull-out test

机译:微键试验中的奇异应力场(ISSFS)的强度与拉出试验中的ISSFS相比

获取原文
获取原文并翻译 | 示例
           

摘要

Micro-bond test is often used to investigate fiber/matrix bonding behavior. In this experiment, the average shear stress is generally used as the interface strength without considering the singular stress. Therefore, in this paper, the intensity of singular stress field (ISSF) is newly analyzed at the fiber entry/exit points. The obtained ISSFs at the fiber entry point in micro-bond test are compared to the single fiber pull-out under the same fiber geometry. The results show that care should be taken for the previous micro-bond test geometry since the ISSF varies sensitively depending on the testing geometry. To control the initial fiber/matrix debonding and evaluate the bonding behavior correctly, suitable testing geometries are proposed in micro-bond testing.
机译:微键测试通常用于研究纤维/基质粘合行为。 在该实验中,平均剪切应力通常用作界面强度而不考虑奇异应力。 因此,在本文中,在纤维入口/出口点新分析了奇异应力场(ISSF)的强度。 将Microb键测试中的纤维入口点的获得的ISSFS与在相同的纤维几何形状下的单根纤维拉出比较。 结果表明,由于ISSF根据测试几何形状而变化,因此应注意前一部分的微债券测试几何。 为了控制初始光纤/矩阵剥离并正确评估粘合行为,提出了合适的测试几何形状在微键测试中。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号