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首页> 外文期刊>International Journal of Machine Tools & Manufacture: Design, research and application >Modeling of chip geometry in ball-end milling of superalloy using strains in deformed chip (SDC) approach
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Modeling of chip geometry in ball-end milling of superalloy using strains in deformed chip (SDC) approach

机译:超基金球端铣削芯片几何形状的建模使用变形芯片(SDC)方法

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摘要

Knowing that the chip geometry helps predict machining forces, energy and consequently the machined surface quality, in the past, various models for the prediction of the undeformed and deformed chip geometries in ballend milling have been evolved. It is observed that most of the models use volume constancy (VC) between the undeformed and deformed chip geometries towards evaluation of deformed chip thickness. This work presents a new approach to the deformed chip geometry evaluation, which involved considering strains in the deformed chips (SDC). In the strains developed in the deformed chip (SDC) approach, bending, compression/shear and thermal strains have been modelled using a simplified tapered cantilever shape of the undeformed chip. The cutting edge-work interactions on horizontal as well as work surfaces inclined at different angles have been considered during the model development. As the workpiece inclination increases from 0 degrees (horizontal) to 60(degrees), the deformed chip thickness increases by 63% due to a higher effective feed per tooth. However, the instantaneous shear angle found constant at 50(degrees) throughout the cut for a typical machining parametric combination. A comparison of SDC and VC approach shows that the magnitudes of deformed chip thickness, shear angle and the resultant cutting forces obtained using SDC models match more closely (within 90%) with the experimental data. It is envisaged that such models when incorporated in the cutting force models, would help predict cutting forces more accurately.
机译:知道芯片几何形状有助于预测加工力,能量,因此加工的表面质量,过去已经演化了用于预测变形铣削中的未变形和变形芯片几何形状的各种模型。观察到,大多数模型在未变形和变形芯片几何形状之间使用体积恒定(VC)朝向变形芯片厚度的评估。这项工作提出了一种新的变形芯片几何评价方法,涉及考虑变形芯片(SDC)中的菌株。在变形芯片(SDC)方法中产生的菌株中,已经使用了未变形芯片的简化锥形悬臂形状进行了建模的弯曲,压缩/剪切和热菌株。在模型开发期间,已经考虑了水平的切削刃和水平的相互作用以及以不同角度倾斜的工作表面。由于工件倾斜度从0度(水平)增加到60(度),因此由于每个齿的较高有效进料,变形芯片厚度增加了63%。然而,对于典型的加工参数组合,在整个切割过程中在50(度)中发现瞬时剪切角。 SDC和VC方法的比较表明,使用SDC模型获得的变形芯片厚度,剪切角和所得切割力的大小与实验数据相匹配更紧密(90%)。可以设想这种模型在切割力模型中结合,可以更准确地预测切割力。

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