The shear strength of transient liquid phase bonded Sn-Bi solder joint with added Cu particles

摘要

In a previous study, the transient liquid phase bonding of the Sn-Bi solder joints with added Cu particles was successfully performed, causing the melting point of the solder joints to increase from 139 to 201 degrees C. However, the solder joints processed in that study contained large voids resulting in a considerable degradation in shear strength. Thus, this study aims to reduce the extent of void formation and consequently improve the shear strength of the particulate-reinforced solder joints. Two distinct phenomena causing the formation of voids at early and final stages of the TLP bonding process are discussed and thermo-compression reflow method is studied as an alternative reflow method. The proposed method was proven to be capable of reducing the formation of voids in the solder joints, resulting in an improvement in the shear strength of the as-reflowed and as thermally aged particulate-reinforced Sn-Bi solder. (C) 2016 The Society of Powder Technology Japan. Published by Elsevier B.V. and The Society of Powder Technology Japan. All rights reserved.