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首页> 外文期刊>International journal of chemical modeling >Tackling Metal-Metal Bond in the Framework of the Bond Valence Sum Formalism. The Case of Cupric Acetate
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Tackling Metal-Metal Bond in the Framework of the Bond Valence Sum Formalism. The Case of Cupric Acetate

机译:在键合价和形式主义的框架中解决金属金属键。 醋酸铜的情况

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摘要

It is demonstrated that Eq. (i) can tackle metal-metal bond. This is exemplified by its application to some thirteen Cu(trichloroacetate)2L (L is a monodentate ligand) complexes and Cu(acetate)_2H_2O. This cannot be done by Pauling's method which is used currently to calculate the bond valence sum (BVS) of a metal in a complex. In Eq. (i),V_i is the BVS of the metal i whose coordination number is n, r_(ij) the bond distance between the metal i and its jth neighbour and R the bond valence parameter characteristic of the bond between the atoms i and j. Bond valence is essentially oxidation state per bond. It is shown that the contribution v(Cu-Cu) of the Cu~(2+)-Cu~(2+) bond towards the total BVS of a copper atom increases as the metal-metal distance decreases. An excellent linear correlation is obtained between v(Cu-Cu) and -2J (the exchange coupling constant).
机译:表明EQ。 (i)可以解决金属金属键。 这通过其在一些十三Cu(三氯乙酸)2L(L是单齿配体)络合物和Cu(乙酸盐)_2H_2O上的应用。 这不能通过鲍林的方法来完成,该方法目前用于计算复合物中金属的键合价和(BVS)。 在方程。 (i),V_I是配位数量为n,R_(ij)金属I及其第j个邻居之间的键距的BV的BV,并且原子I和j之间的键合的键合价参数特性。 键合效果基本上是每个键的氧化状态。 结果表明,随着金属 - 金属距离的降低,Cu〜(2 +)-Cu〜(2+)键朝向铜原子的总BV的贡献V(Cu-Cu)增加。 在V(Cu-Cu)和-2J(交换耦合常数)之间获得优异的线性相关性。

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