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首页> 外文期刊>International journal of applied mechanics >Simulation of the Electrostatic Distribution in the Proximity Focusing Structure of an EBCMOS
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Simulation of the Electrostatic Distribution in the Proximity Focusing Structure of an EBCMOS

机译:eBCMOS接近聚焦结构静电分布的仿真

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摘要

The electrostatic distribution of an electron bombarded CMOS (EBCMOS) was simulated by Ansoft Maxwell 3D software. Specifically, we studied how the electrostatic distribution was affected by the structure of a back-side bombarded CMOS (BSB-CMOS) and the anode position in electron-bombarded sensors. The simulation results reveal that the electrostatic field may cause a fault in the signal readout of the BSB-CMOS when the anode is positioned under the BSB-CMOS. In contrast, we found that the structure of an EBCMOS will aid electron focusing when the anode is positioned above the BSB-CMOS and the doping concentration of the electron multiplier layer is high. However, the high doping concentration of the electron multiplier layer will reduce the electron collection efficiency due to its rapid electron-hole recombination. We then designed a structure in which the multiplier layer has an overlying ultra-thin highly-doped layer, with an electrostatic distribution that functions to focus electrons. At the same time, this configuration can effectively prevent most of the multiplier electrons from recombining because ultra-thin highly-doped layer is much thinner than incident depth for the high-energy electron. This simulation study will provide a theoretical foundation for the fabrication of high-performance EBCMOS devices. Graphic abstract: a) EBCMOS physical model in Ansoft Maxwell 3D; b) The distribution of electrostatic distribution for BSB-CMOS with an ultra-thin heavily-doped layer. Electrostatic distribution of EBCMOS with different configurations were simulated. The results reveal that the electrostatic field may cause an erroneous readout of the BSB-CMOS if the anode is positioned under the BSB-CMOS. If the high voltage anode is positioned above the CMOS sensor, this is improved, especially when an ultrathin highly-doped multiplier layer is added to improve electron collection efficiency. This study provides a theoretical foundation for the fabrication of high performance EBCMOS devices.
机译:通过ANSoft Maxwell 3D软件模拟了电子轰炸CMOS(EBCMOS)的静电分布。具体地,我们研究了静电分布如何受到背面轰击的CMOS(BSB-CMOS)的结构的影响,以及电子轰击传感器中的阳极位置。仿真结果表明,当阳极位于BSB-CMOS下时,静电场可能导致BSB-CMOS的信号读数中的故障。相反,我们发现,当阳极位于BSB-CMOS上方时,EBCMOS的结构将有助于电子聚焦,并且电子乘法层的掺杂浓度高。然而,由于其快速的电子空穴重组,电子乘法层的高掺杂浓度将降低电子收集效率。然后,我们设计了一种结构,其中乘法层具有覆盖的超薄高掺杂层,其具有用于聚焦电子的静电分布。同时,这种配置可以有效地防止大部分乘法器电子重新组合,因为超薄高掺杂层比高能电子的入射深度要薄。该模拟研究将为制造高性能EBCMOS器件提供理论基础。图形摘要:A)ANSoft Maxwell 3D中的EBCMOS物理模型; b)具有超薄重掺杂层的BSB-CMOS的静电分布的分布。模拟了具有不同配置的EBCMO的静电分布。结果表明,如果阳极位于BSB-CMOS下方,则静电场可能导致BSB-CMOS的错误读出。如果高压阳极位于CMOS传感器上方,则改善这一点,特别是当加入超薄高掺杂的乘法层以提高电子收集效率时。本研究为高性能EBCMOS器件制造提供了理论基础。

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