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首页> 外文期刊>Integrated Ferroelectrics >Fabrication of Cu/Nafion-Based Ionic Polymer Metal Composites by Electroless Plating Method
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Fabrication of Cu/Nafion-Based Ionic Polymer Metal Composites by Electroless Plating Method

机译:化学镀方法制备Cu / Nafion基离子聚合物金属复合材料

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摘要

The Cu/Nafion-based ionic polymer metal composites were analyzed in terms morphology, proton conductivity, water loss, displacement and blocking force performance were examined. The SEM images revealed that Cu particles distribution is uniform and compact on the surface of Nafion membrane due to continuous heterogeneous nucleation and grain growth. The IPMC is composed of the ionomer membrane layer, the middle layer and the surface electrode layer. A less water restricts the migration of the hydrated cation transfer, and causes the migration barrier, resulting in reducing conductivity of the IPMCs. The maximum displacement and maximum force are 30 mm and 9.1 mN.
机译:检查Cu / Nafion基离子聚合物金属复合材料,检查了形态,质子电导率,水损,位移和阻断力性能。 SEM图像由于连续的非均相成核和晶粒生长而揭示Cu颗粒分布在Nafion膜的表面上是均匀的并且紧凑。 IPMC由离聚物膜层,中间层和表面电极层组成。 较少的水限制了水合阳离子转移的迁移,并导致迁移屏障,导致IPMC的电导率降低。 最大位移和最大力是30mm和9.1mn。

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