Thermal contact resistance of different materials between 0.3 K and 4.5 K

摘要

The choice of a good bonding agent often depends on the temperature range of use and on its corresponding thermal contact resistance. Measurements obtained between 0.3 K and 4.5 K were made applying the steady state heat flow method across the interfaces of small crystals of quartz (SO_2) sandwiched by two copper blocks and attached with various types of contact materials. Below 1 K, we found that for one crystal attached with indium solder its thermal contact resistance was R_B~(-1) approx = 0.68Y~3 W/cm~2K. This value in comparison with those attached with a conductive and an insulating epoxies, turns to be the lowest.