THE INFLUENCES OF SOLUTION PH AND CURRENT DENSITY ON COERCIVITY OF ELECTROPLATING CoNdNiMnP PERMANENT MAGNETIC ALLOY FILM ARRAYS

摘要

The influences of plating bath solution PH and current density on coercivity of electroplating CoNdNiMnP permanent magnetic film arrays were studied. The experiment results show that both for solution PH and current density there were the best depositing parameters. Too high and too low plating bath solution PH or current density both result in decreasing of the film array coercivity. When solution PH is 3.5 and current density is 5mA/cm2, the prepared film array coercivity can reach the maximum.