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Increase of chip removal rate in single-lip deep hole drilling at small diameters by low-frequency vibration support

机译:通过低频振动支撑,单唇深孔钻孔中芯片去除率的增加

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摘要

In order to promote active chip breakage in machining with single-lip drills for drilling deep holes with small diameters, vibration-assistance can be effectively applied. The aim of this work is to investigate the influence of low-frequency and high-amplitude vibration-assistance on the chip formation of age-hardened copper-zirconium for small diameters down to 0.94 mm and L/D-ratios up to 40. The interrelation of vibration and process parameters, like the resulting uncut chip thickness and effective velocity, is described by a kinematic model. The influence of the vibration-assistance on the chipping behavior is investigated by means of FEM-simulation and experimental analyses using a piezo-actuated test setup. (C) 2019 Published by Elsevier Ltd on behalf of CIRP.
机译:为了促进用单唇钻加工的主动芯片破损,用于钻孔小径小径,可以有效地应用振动辅助。 这项工作的目的是研究低频和高幅度振动 - 辅助对年龄硬化铜 - 锆的芯片形成的影响,小直径下降至0.94mm,L / D比最高可达40. 振动和工艺参数的相互关系,如所产生的未产生的未切换芯片厚度和有效速度,由运动模型描述。 通过使用压电致动试验设置,通过FEM模拟和实验分析研究了振动辅助对切削行为的影响。 (c)2019年由elsevier有限公司发布代表CIRP。

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