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Fabrication of metal-nanoparticle-modified semiconducting copper- and silver-TCNQ materials as substrates for the reduction of chromium(VI) using thiosulfate ions at ambient temperature

机译:在环境温度下使用硫代硫酸硫酸硫酸硫代硫酸硫酸硫代硫酸硫代硫酸盐将金属纳米粒子改性半导体铜和银 - TCNQ材料的制造为基质中的底物(VI)

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The formation of readily recoverable and reusable organic semiconducting Cu- and AgTCNQ (TCNQ=7,7,8,8-tetracyanoquinodimethane) microstructures decorated with Pt and Pd metallic nanoparticles is described for the effective reduction of CrVI ions in aqueous solution at room temperature using both formic acid and an environmentally friendly thiosulfate reductant. The M-TCNQ (M=metal) materials were formed by electrocrystallisation onto a glassy carbon surface followed by galvanic replacement in the presence of H 2PtCl6 or PdCl2 to form the composite material. It was found that loading of the surface with nanoparticles could easily be controlled by changing the metal salt concentration. Significantly, the M-TCNQ substrates facilitated the formation of well-isolated metal nanoparticles on their surfaces under appropriate galvanic replacement conditions. The semiconductor-metal nanoparticle combination was also found to be critical to the catalyst performance, wherein the best-performing material was CuTCNQ modified by well-isolated Pt nanoparticles with both formic acid and thiosulfate ions as the reductant. In reduced circumstances: Readily recoverable and reusable organic semiconducting Cu- and AgTCNQ (TCNQ=7,7,8,8- tetracyanoquinodimethane) microstructures decorated with Pt and Pd nanoparticles have been applied to the removal of CrVI ions from aqueous solutions at room temperature using thiosulfate as reductant (see figure). The semiconductor-metal nanoparticle combination is critical to the catalyst performance: the best-performing material is CuTCNQ/Pt.
机译:描述用Pt和Pd金属纳米粒子装饰的容易可回收和可重复使用的有机半导体Cu-和AgTCNQ(TCNQ = 7,7,7,8-四环二甲喹甲喹甲烷)微结构,用于在室温下有效减少水溶液中的CRVI离子在水溶液中的有效减少甲酸和环保硫代硫酸盐还原剂。通过电镀在玻璃状碳表面上,在H 2PTCL6或PdCl 2存在下进行电烫金形成M-TCNQ(M =金属)材料,然后在存在H 2PTCL6或PdCl2形成复合材料中。发现通过改变金属盐浓度,可以容易地控制用纳米颗粒加载表面。值得注意的是,M-TCNQ底物在适当的电丹型更换条件下促进了在它们的表面上形成的良好隔离的金属纳米颗粒。还发现半导体金属纳米颗粒组合对催化剂性能至关重要,其中通过用甲酸和硫代硫酸硫代硫酸硫代硫酸硫代硫酸盐离子改性最佳性能的材料。在减少情况下:用Pt和Pd纳米颗粒装饰的易于可回收和可重复使用的有机半导体Cu-和AgTcNQ(TCNQ = 7,7,8,8-四氰基二甲喹甲喹甲烷)微结构,用于使用室温下从水溶液中除去CRVI离子。硫代硫酸盐作为还原剂(见图)。半导体金属纳米颗粒组合对催化剂性能至关重要:最佳性能的材料是CUTCNQ / PT。

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