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SU-8-carbon composite as conductive photoresist for biochip applications

机译:SU-8-碳复合材料用作生物芯片应用的导电光致抗蚀剂

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摘要

A composite photoresist has been developed for the direct photopatterning of electrodes useful as biochip substrates. The material is composed of SU-8 polymer added with graphite carbon filler which enables patterning of conductive thin films (22 μm) on both glass substrate and transparency flexible film with a standard UV photolithography protocol. The resolution obtained using the conductive composite compared well with the bare resist, with lateral resolutions of 5 and 10 μm for bare and conductive resists, respectively. The obtained electrodes, after an electrochemical pre-treatment, exhibited very good electrochemical behaviors, opening the path to various electrochemical detections and grafting possibilities. In order to demonstrate the potentialities of the developed material in the biosensors and biochips field, DNA probes were electrografted, using diazonium chemistry, directly at the composite photoresist surface. Target oligonucleotide interactions were detected using chemiluminescent labeling and a satisfactory detection limit of 0.25. nM target sequence was demonstrated with a detection ranging over three orders of magnitude.
机译:已经开发出一种复合光致抗蚀剂,用于直接光图案化用作生物芯片衬底的电极。该材料由添加了石墨碳填料的SU-8聚合物组成,该石墨碳填料可通过标准的UV光刻协议在玻璃基板和透明柔性膜上对导电薄膜(22μm)进行构图。使用导电复合材料获得的分辨率与裸露抗蚀剂相比具有很好的对比,裸露和导电抗蚀剂的横向分辨率分别为5和10μm。在电化学预处理之后,获得的电极表现出非常好的电化学行为,为各种电化学检测和接枝可能性开辟了道路。为了证明开发的材料在生物传感器和生物芯片领域的潜力,直接使用DNA探针使用重氮化学技术将DNA探针直接植入了复合光刻胶表面。使用化学发光标记检测目标寡核苷酸相互作用,令人满意的检测限为0.25。 nM靶序列的检测范围超过了三个数量级。

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