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机译:玻璃各向异性硅双层晶片激光切割裂缝断裂模式和边缘质量研究
Harbin Inst Technol Sch Mechatron Engn Minist Educ Key Lab Microsyst &
Microstruct Mfg Harbin 150001 Peoples R China;
Harbin Inst Technol Sch Mechatron Engn Minist Educ Key Lab Microsyst &
Microstruct Mfg Harbin 150001 Peoples R China;
Harbin Inst Technol Sch Mechatron Engn Minist Educ Key Lab Microsyst &
Microstruct Mfg Harbin 150001 Peoples R China;
Harbin Inst Technol Sch Mechatron Engn Minist Educ Key Lab Microsyst &
Microstruct Mfg Harbin 150001 Peoples R China;
Harbin Inst Technol Sch Mechatron Engn Minist Educ Key Lab Microsyst &
Microstruct Mfg Harbin 150001 Peoples R China;
Harbin Inst Technol Sch Mechatron Engn Minist Educ Key Lab Microsyst &
Microstruct Mfg Harbin 150001 Peoples R China;
Glass-anisotropic single-crystal silicon double-layer wafer; Laser induced thermal-crack propagation; Static seam-type crack; Crack fracture mode; Crack edge quality;
机译:玻璃各向异性硅双层晶片激光切割裂缝断裂模式和边缘质量研究
机译:(技术交流)使用超短脉冲激光在200 fs至10 ps的范围内对薄硅晶片进行切割
机译:使用激光将薄硅晶片切成小方块
机译:薄硅片切割过程中基板厚度对切割质量影响的研究
机译:为硅互连结构(Si-IF)开发晶圆穿孔(TWV)和等离子切割工艺
机译:硅晶片在热应力下的裂纹扩展和断裂
机译:超短脉冲激光器在200 fs至10 ps的范围内对薄硅晶片进行切割