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首页> 外文期刊>Journal of Electronic Materials >Micro-structure, Mechanical Properties and Dielectric Properties of Bisphenol A Allyl Compound-Bismaleimide Modified by Super-Critical Silica and Polyethersulfone Composite
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Micro-structure, Mechanical Properties and Dielectric Properties of Bisphenol A Allyl Compound-Bismaleimide Modified by Super-Critical Silica and Polyethersulfone Composite

机译:双酚A烯丙基化合物 - 双酰胺的微结构,机械性能和介电性能通过超临界二氧化硅和聚醚砜复合材料改性

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摘要

Bisphenol A allyl compound-bismaleimide (MBAE) composite modified by SCE-SiO2 and polyethersulfone (PES) resin has been prepared and researched. SCE-SiO2 was modified by super-critical ethanol and PES thermoplastic resin used as modifiers. The composite was prepared via the hot melting method. The FT-IR measurements indicated that ethanol molecular had adsorbed on the nano-SiO2 surface. SEM images showed that the composite had a multiphase structure, PES and SCE-SiO2 existed as a dispersed phase, and the interaction of the three phases affected each other, such that the bending fracture behavior transformed from brittle fracture to ductile fracture, and the modifiers of SCE-SiO2 and PES resin could improve the mechanical properties. The impact and the bending strength of the composite was 16.5 kJ/mm(2) and 150.4 MPa, improved by 68.3% and 56.7% compared with those of the MBAE matrix, respectively, when the content of SCE-SiO2 was 2 wt.% and PES 5 wt.%. The dielectric constant (epsilon) of the composites was less than 3.9 and decreased with increasing frequency, and the dielectric loss was less than 9 x 10(-3) for frequencies between 10(2) Hz and 10(5) Hz. These properties could meet the requirement of insulating material.
机译:通过SCE-SiO 2和聚醚砜(PES)树脂改性的双酚A烯丙基化合物 - 双聚物(MBAE)复合材料已经制备和研究。 SCE-SiO2通过超临界乙醇和PES热塑性树脂作为改性剂进行修饰。复合材料通过热熔法制体制备。 FT-IR测量表明,乙醇分子已经吸附在纳米SiO 2表面上。 SEM图像显示复合物具有多相结构,PE和SCE-SiO2作为分散相存在,并且三相的相互作用彼此影响,使得弯曲断裂行为从脆性骨折转化为韧性骨折,以及改性剂SCE-SiO2和PES树脂可以改善机械性能。复合材料的抗冲击和弯曲强度分别为16.5kJ / mm(2)和150.4MPa,与MBAE基质的含量分别增加68.3%和56.7%,当SCE-SiO 2的含量为2重量%时和pes 5 wt.%。复合材料的介电常数(ε)小于3.9并随着频率的增加而降低,介电损耗小于9×10(-3),用于10(2)Hz和10(5)Hz之间的频率。这些性质可以满足绝缘材料的要求。

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