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Mechanism of formation of the honeycomb-like structures by the regime of the reversing current (RC) in the second range

机译:第二范围内逆流电流(RC)的制度形成蜂窝状结构的机制

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摘要

Electrodeposition of copper in the hydrogen co-deposition range by the regime of reversing current (RC) in the second range has been investigated by determination of the average current efficiency for hydrogen evolution reaction and by scanning electron (SEM) and optical (OM) microscopic analysis of the obtained deposits. Keeping the cathodic current density, the cathodic and the anodic pulses constant in all experiments, the anodic current density (j(a)) values were varied: 40, 80, 160, 240 and 320 mA cm(-2). The Cu deposits produced by the RC regimes with different anodic current density values were compared with that obtained in a constant galvanostatic regime (DC) at the current density equal to the cathodic current density in the RC regimes. The honeycomb-like structures were formed in the DC regime and by the RC regimes with j(a), of 40 and 80 mA cm(-2). The hole size in them was in the 60-70 mu m range. Due to the decrease of quantity of evolved hydrogen with increasing anodic current density, the larger dish-like holes with dendrites at their bottom and shoulder were formed with j(a) values of 160, 240 and 320 mA cm(-2). The maximum number of holes, and hence, the largest specific surface area of the honeycomb-like electrodes was obtained with j(a) = 80 mA cm(-2), that can be ascribed to a suppression of coalescence of neighboring hydrogen bubbles. Application of the RC regime also led to the increase of uniformity of structures, what is concluded by cross section analysis of the formed honeycomb-like electrodes. For the first time, mechanism of Cu electrodeposition in the hydrogen co-deposition range by the RC regime in the second range was proposed and discussed.
机译:通过测定氢进化反应的平均电流效率和通过扫描电子(SEM)和光学(OM)微观来研究第二种范围内的氢气共沉积范围的荷荷加定范围的电沉积。分析所得沉积物。保持阴极电流密度,阴极和阳极脉冲恒定在所有实验中,阳极电流密度(J(a))值变化:40,80,160,240和320mA cm(-2)。将具有不同阳极电流密度值的RC制度产生的Cu沉积与在恒定的电流状态(DC)中获得的电流密度等于RC制度中的阴极电流密度。蜂窝状的类似结构形成在DC制度中,并通过j(a)的rc制度,为j(a),为40和80ma cm(-2)。它们中的孔尺寸在60-70 mu m范围内。由于随着阳极电流密度的增加,进化氢的量减少,底部和肩部的较大的盘状孔形成为160,240和320mA cm(-2)的j(a)值。用J(a)= 80mA cm(-2)获得蜂窝状电极的最大孔的最大孔数,可以归因于抑制相邻氢气泡的聚结的抑制。 RC制度的应用还导致了结构均匀性的增加,所形成的蜂窝状电极的横截面分析结论的结论。首次,提出了第二个范围内RC制度在氢共沉积范围内Cu电沉积的机制,并讨论。

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