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首页> 外文期刊>Journal of Colloid and Interface Science >Boron and nitrogen co-doped double-layered mesopore-rich hollow carbon microspheres as high-performance electrodes for supercapacitors
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Boron and nitrogen co-doped double-layered mesopore-rich hollow carbon microspheres as high-performance electrodes for supercapacitors

机译:硼和氮和氮掺杂双层中孔的中空碳微球作为超级电容器的高性能电极

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In this paper, double-layered mesopore-rich hollow carbon microspheres (DHCM) were prepared by a Stober method using tetraethyl orthosilicate, resorcinol and formaldehyde as precursor materials, and further utilized as carbon sources to prepare the boron and nitrogen co-doped double-layered mesopore-rich hollow carbon microspheres (B, N-DHCM) by hydrothermal approach utilizing ammonium tetraborate tetrahydrate (NH4B5O8 center dot 4H(2)O) as boron and nitrogen sources. Compared with the undoped DHCM, the as-obtained B, N-DHCM displays improved capacitive properties with a high specific capacitance (221.5 F g(-1) at 1 A g(-1)), good rate performance (104.1 F g(-1) at 20 A g(-1)) and superior cycle life (91% of capacitance retention at 3 A g(-1) after 10,000 cycles). The outstanding capacitive performances result from the synergistic effect of the unique double-layered mesopore-rich hollow structure contributing to the rate property and cycle stability and the modification of B and N co-doping providing pseudocapacitance for the enhancement of specific capacitance. Therefore, the excellent capacitive behaviors render the B, N-DHCM promising electrode materials for application in supercapacitors and other energy storage systems. (C) 2020 Elsevier Inc. All rights reserved.
机译:在本文中,通过使用四乙基硅酸盐,间苯二酚和甲醛作为前体材料,通过达乙基硅酸盐,四甲醇和甲醛作为前体材料制备双层富含缺乏的中空碳微球(DHCM),并进一步用作碳源以制备硼和氮掺杂双重利用铵四水合物(NH4B5O8中心点4h(2)O)作为硼和氮源的水热方法分层中孔中空碳微球(B,N-DHCM)。与未掺杂的DHCM相比,如获得的B,N-DHCM显示出具有高比电容的改进的电容性能(221.5 f g(-1),在1 a g(-1)),速率差效(104.1f g( -1)在20 a g(-1))和10,000个循环后的优越的循环寿命(在3Ag(-1)的高温循环寿命(91%)。优异的电容性能是由于独特的双层富含缺陷的中空结构的协同效应,这有助于速率性能和循环稳定性以及B和N共掺杂的改性,为提高特定电容提供假偶像。因此,优异的电容性行为使B,N-DHCM有希望的电极材料用于超级电容器和其他能量存储系统中的应用。 (c)2020 Elsevier Inc.保留所有权利。

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