机译:Mn纳米粒子对低Ags-0.3Ag-0.7Cu-XMN焊料合金和关节拉伸性能的影响
Zhongkai Univ Agr &
Engn Coll Automat 501 Zhongkai Rd Guangzhou 510225 Guangdong Peoples R China;
Zhongkai Univ Agr &
Engn Coll Automat 501 Zhongkai Rd Guangzhou 510225 Guangdong Peoples R China;
Zhongkai Univ Agr &
Engn Coll Automat 501 Zhongkai Rd Guangzhou 510225 Guangdong Peoples R China;
South China Univ Technol Sch Elect &
Informat Engn Guangzhou 510641 Guangdong Peoples R China;
South China Univ Technol Sch Elect &
Informat Engn Guangzhou 510641 Guangdong Peoples R China;
Lead-free solder; Mn nanoparticles; Tensile properties; Stain rate; Test temperature; Aging time;
机译:Mn纳米粒子对低Ags-0.3Ag-0.7Cu-XMN焊料合金和关节拉伸性能的影响
机译:Mn纳米粒子添加对低Ag-0.3Ag-0.7Cu-XMN(NP)复合焊料的润湿性,微观结构和显微硬度的影响
机译:在等温老化期间,低Ag Sn-0.3Ag-0.7Cu-XMN / Cu焊点界面Cu6Sn5和Cu3Sn5和Cu3Sn层的形态演化与生长动力学
机译:镁,锰含量对Al-Mg-Mn合金热轧温度和拉伸性能的影响
机译:低熔点,低Ag,含双Pb焊料合金的表征
机译:焊接工艺和间隙距离对Ni-Cr合金焊接接头抗拉强度的影响
机译:Go纳米颗粒添加对Sn-3.5Ag-0.7Cu无铅焊料合金的拉伸性能和变形温度的影响
机译:合金化sN-pb焊点的拉伸和剪切行为。