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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Preparation of a SiCf/Al composite precursor by electrochemical deposition in a LiCl-KCl-AlCl3 molten salt
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Preparation of a SiCf/Al composite precursor by electrochemical deposition in a LiCl-KCl-AlCl3 molten salt

机译:通过LiCl-Kcl-AlCl3熔融盐中的电化学沉积制备SICF / Al复合前体

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摘要

The preparation of suitable SiC fiber (SiCf)/Al precursors is crucial for the fabrication of SiCf-strengthened Al alloys. In this work, a SiCf/Al precursor was prepared by pulse current deposition in a molten LiCl-KCl AlCl3 melt. The electrochemical deposition of Al3+ was separately investigated on the Mo wire, Cu wire, SiCf, and Cu-coated SiCf electrodes. The intermediate Cu layer can eliminate the Li generated by the underpotential deposition on the carbon layer outside SiCf. In addition, open circuit chronopotentiometry was performed to confirm the reduction processes of Al3+ on the Cu wire and Cu coated SiCf, and the results indicate that Al3+ exhibits similar reduction processes on the two electrodes. The deposited Al layer possibly formed Al Cu alloys with the intermediate Cu layer on SiCf, which was beneficial to the connection between the Al layer and SiCf substrate. Scanning electron microscopy was employed to investigate the morphology and microstructure of the prepared SiCf/Al fiber. After the pulse current was optimized, a compact and even layer of Al was deposited on SiCf. (C) 2017 Published by Elsevier B.V.
机译:合适的SiC纤维(SICF)/ Al前体的制备对于制造SiCF加强的Al合金至关重要。在这项工作中,通过熔融LiCl-Kcl AlCl3熔体中的脉冲电流沉积制备SICF / Al前体。在Mo线,Cu线,SiCF和Cu涂覆的SICF电极上单独研究Al3 +的电化学沉积。中间Cu层可以消除由SICF外的碳层上的潜在沉积产生的锂。另外,进行开路时间计量测量测定法以确认在Cu线和Cu涂覆的SICF上的Al 3 +的还原过程,结果表明Al3 +在两个电极上表现出类似的还原过程。沉积的Al层可能形成Al Cu合金与SICF上的中间Cu层,这对Al层和SiCF基材之间的连接有益。使用扫描电子显微镜检查制备的SICF / Al纤维的形态和微观结构。优化脉冲电流后,沉积在SICF上沉积一块Al Al层。 (c)2017年由Elsevier B.V发布。

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