首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Effect of beam current on microstructure, phase, grain characteristic and mechanical properties of Ti-47Al-2Cr-2Nb alloy fabricated by selective electron beam melting
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Effect of beam current on microstructure, phase, grain characteristic and mechanical properties of Ti-47Al-2Cr-2Nb alloy fabricated by selective electron beam melting

机译:光束电流对选择性电子束熔化制造Ti-47Al-2Cr-2NB合金的微结构,相,晶粒特性和力学性能的影响

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Selective electron beam melting (SEBM) is a promising manufacturing technology, which offers several processing parameters to select to change microstructure and even to tailor the microstructure. In this paper, the influence of beam current on microstructure, phase composition, grain boundary misorientation and mechanical performances of a Ti-47Al-2Cr-2Nb alloy produced by SEBM was investigated. The results illustrated that with enhancing the beam current, the microstructure changed from fine duplex with the average grain size of 3.02 mu m to near gamma structure with the average grain size of 6.28 mu m. The volume fraction of B2 phase gradually increased from 2.8% to 18.8% with increasing beam current from 4.5 mA to 8.5 mA. The high angle grain boundary (89 +/- 3 degrees) gradually increased and the low angle grain boundary (1-5 degrees) continuously decreased with the enhancing beam current. The ultimate compression strength (UCS) of SEBM-processed TiAl alloy decreased from 2930.95 MPa to 2456.82 MPa and the strain (delta) decreased from 34.82% to 27.44% with increasing the beam current from 4.5 mA to 8.5 mA. Recovery and recrystallization could be observed within the as-built samples, and the effect of beam current on these processes was investigated. (C) 2018 Elsevier B.V. All rights reserved.
机译:选择性电子束熔化(SEBM)是一个有前途的制造技术,其提供了几种处理参数,可选择改变微观结构,甚至定制微结构。本文研究了SEBM生产的Ti-47Al-2Cr-2NB合金的微观结构,相组合物,晶界错误化和机械性能的微观结构,相组合物,晶界错误和机械性能的影响。结果表明,随着梁电流的增强,微观结构从细双相变化,平均晶粒尺寸为3.02μm,接近伽马结构,平均晶粒尺寸为6.28 mu m。 B2相的体积分数逐渐从2.8%增加到18.8%,从4.5 mA增加到8.5 mA的光束电流增加。高角度晶界(89 +/- 3度)逐渐增加,并且低角度晶界(1-5度)随着增强光束电流连续降低。 SEBM加工的TiAL合金的极限压缩强度(UCS)从2930.95MPa降低至2456.82MPa,菌株(δ)从34.82%降低到27.44%,随着4.5 mA的增加,射线电流增加到8.5 mA。可以在制造的样品内观察回收和重结晶,并研究了光束电流对这些过程的影响。 (c)2018年elestvier b.v.保留所有权利。

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