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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Temperature dependence of the mechanical and thermal expansion behaviors of MoSi2-RSiC composites with a three-dimensionally (3D) interpenetrated network structure
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Temperature dependence of the mechanical and thermal expansion behaviors of MoSi2-RSiC composites with a three-dimensionally (3D) interpenetrated network structure

机译:MOSI2-RSIC复合材料的机械和热膨胀行为具有三维(3D)互连网络结构的温度依赖性

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In this paper, microstructure and temperature dependence of mechanical properties and thermal expansion coefficient (TEC) of the MoSi2-RSiC composites was investigated via XRD, SEM, mechanical and thermal behaviors test, etc. three-dimensionally fracture photographs confirm the 3D interpenetrating network structure of the composites, main compositions of the composites are 6H-SiC and tetragonal-MoSi2, a small amount of Mo4.8Si3C0.6 mainly exists on the interface between RSiC and MoSi2; With the increase of tested temperatures, flexural strength and fracture toughness of the composites both increase, fracture toughness of M-S-2.30 reaches 2.05 MPa m(1/2) (1400 degrees C), showing the highest improvement of 57.69% as compared to that of RT value, the interface cracks self-healing behavior occurred at higher temperatures helps to improve the interface compressive stresses and increase the fracture toughness of the composites; With the increase of volume fraction of MoSi2, TEC values of the composites increase, mainly being due to the bond energy difference between Mo-Si (76.020 kJ mol(-1)) and Si-C(285.0 kJ mol(-1)) bonds. Theoretical analysis exhibits that modified Kerner model is fitter to express the temperature dependence of thermal expansion behavior of 3D interpenetrated network structure composites than that of modified Kerner and Schapery bound model. (C) 2017 Elsevier B.V. All rights reserved.
机译:本文通过XRD,SEM,机械和热行为测试研究了MOSI2-RSIC复合材料的机械性能和热膨胀系数(TEC)的微观结构和温度依赖性。三维骨折照片确认了3D互穿网络结构在复合材料中,复合材料的主要组合物是6H-SiC和四方 - MOSI2,少量MO4.8SI3C0.6主要存在于RSIC和MOSI2之间的界面上;随着测试温度的增加,复合材料的抗弯强度和断裂韧性增加,MS-2.30的断裂韧性达到2.05MPa m(1/2)(1400℃),与此相比,最高提高57.69% Rt值,界面裂缝在较高温度下发生的自愈行为有助于改善界面压缩应力并增加复合材料的断裂韧性;随着MOSI2的体积分数的增加,复合材料的TEC值增加,主要是由于MO-Si(76.020kJMol(-1))和Si-C(285.0kJMol(-1)之间的粘合能量差债券。理论分析表明,修改的克尼尔模型变得更加重型,以表达3D互连网络结构复合材料的热膨胀行为的温度依赖性而不是修改的克尼尔和群界模型。 (c)2017年Elsevier B.V.保留所有权利。

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