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The pressureless sintering of micron silver paste for electrical connections

机译:微米银膏的无压烧结用于电气连接

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摘要

In this paper, we explore the pressureless sintering of spherical micron silver paste for electrical connections. The micron silver paste was sintered under different temperature in the range of 200-300 degrees C in air. The experimental results show that the density, shear strength, area ratio of fracture surface, and thermal/electric properties of sintered Ag joint increased with increasing temperature. The sample sintered at 280 degrees C have strong bonding strength, and excellent electrical/thermal performance (comparable with nano silver and even higher than Sn paste). Our protocol will provide beneficial reference for the application of sintering micron Ag paste in electrical connections. (C) 2019 Elsevier B.V. All rights reserved.
机译:在本文中,我们探讨了用于电气连接的球面微米银膏的无压烧结。 将微米银浆在空气中的不同温度下烧结在200-300℃的范围内。 实验结果表明,骨折表面的密度,剪切强度,面积比和烧结Ag关节的热/电性能随着温度的增加而增加。 在280℃下烧结样品具有强粘接强度,并且具有优异的电/热性能(与纳米银相当,甚至高于Sn糊剂)。 我们的协议将为在电连接中施加烧结微米效应浆料提供有益的参考。 (c)2019 Elsevier B.v.保留所有权利。

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