首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Laser cladding of Ni based powder on a Cu-Ni-Al glassmold: Influence of the process parameters on bonding quality and coating geometry
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Laser cladding of Ni based powder on a Cu-Ni-Al glassmold: Influence of the process parameters on bonding quality and coating geometry

机译:基于Cu-Ni-Al玻璃制造的Ni基粉末的激光覆层:工艺参数对粘接质量和涂层几何的影响

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Laser cladding of a Ni based powder on cupro-nickel-aluminum (Cu-Ni-Al) substrate was performed with a 4 kW continuous laser. The Cu-Ni-Al alloy is used for its thermal properties in glass mold industry. The role of the Ni based alloy clad is to protect the mold without affecting its thermal properties by limiting the heat-affected zone. The objective of this research is to produce a well bonded Ni based melted powder without pores or cracks and with a very small dilution zone on a non-planar surface (curved section). The impact of the process parameters such as laser power, scanning speed and powder feeding rate on the coating geometry was investigated with an experimental design technique analysis using the ANOVA (Analysis of variance) method. It was used to determine and represent the influence of each process parameter on the coating geometry (width, height) and the bonding quality. This ANOVA analysis led to a parameter combination to optimize the bonding quality between the Ni coating and the Cu-Ni-Al substrate taking into account the industrial geometrical constraints. More, an analytical calculation allowed to estimate the power necessary for bonding as a function of laser scanning speed and powder feeding rate. (C) 2018 Elsevier B.V. All rights reserved.
机译:用4kW连续激光进行Cupro-镍 - 铝(Cu-Ni-Al)底物上的基于Ni基粉末的激光覆层。 Cu-Ni-Al合金用于玻璃模具行业的热性能。 Ni基合金包层的作用是通过限制热影响区域来保护模具而不影响其热性质。该研究的目的是在非平面表面(弯曲部分)上产生没有孔或裂缝的孔或裂缝的粘合的Ni基于熔融的粉末,并且在非平面表面上具有非常小的稀释区。采用ANOVA(方差分析)方法,研究了诸如激光功率,扫描速度,粉末进给速率的过程参数的影响,例如涂层几何形状,采用实验设计技术分析(方差分析)方法。它用于确定和代表每个过程参数对涂层几何形状(宽度,高度)和粘接质量的影响。该ANOVA分析导致参数组合,以优化Ni涂层和Cu-Ni-Al基板之间的键合质量,考虑到工业几何约束。更多,允许分析计算来估计作为激光扫描速度和粉末进料速率的函数键合所需的功率。 (c)2018年elestvier b.v.保留所有权利。

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