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首页> 外文期刊>Journal of Applied Polymer Science >Fumed SiO2 nanoparticle reinforced biopolymer blend nanocomposites with high dielectric constant and low dielectric loss for flexible organic electronics
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Fumed SiO2 nanoparticle reinforced biopolymer blend nanocomposites with high dielectric constant and low dielectric loss for flexible organic electronics

机译:发热的SiO2纳米粒子增强的生物聚合物混合纳米复合材料,具有高介电常数和低介电损耗的柔性有机电子

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摘要

In the present study, fumed silica (SiO2) nanoparticle reinforced poly(vinyl alcohol) (PVA) and poly(vinylpyrrolidone) (PVP) blend nanocomposite films were prepared via a simple solution-blending technique. Fourier transform infrared spectroscopy (FTIR), ultraviolet-visible spectroscopy (UV-vis), X-ray diffraction (XRD), and scanning electron microscopy (SEM) were employed to elucidate the successful incorporation of SiO2 nanoparticles in the PVA/PVP blend matrix. A thermogravimetric analyzer was used to evaluate the thermal stability of the nanocomposites. The dielectric properties such as dielectric constant (epsilon) and dielectric loss (tan delta) of the PVA/PVP/SiO2 nanocomposite films were evaluated in the broadband frequency range of 10(-2) Hz to 20 MHz and for temperatures in the range 40-150 degrees C. The FTIR and UV-vis spectroscopy results implied the presence of hydrogen bonding interaction between SiO2 and the PVA/PVP blend matrix. The XRD and SEM results revealed that SiO2 nanoparticles were uniformly dispersed in the PVA/PVP blend matrix. The dielectric property analysis revealed that the dielectric constant values of the nanocomposites are higher than those of PVA/PVP blends. The maximum dielectric constant and the dielectric loss were 125 (10(-2) Hz, 150 degrees C) and 1.1 (10(-2) Hz, 70 degrees C), respectively, for PVA/PVP/SiO2 nanocomposites with 25 wt % SiO2 content. These results enable the preparation of dielectric nanocomposites using a facile solution-casting method that exhibit the desirable dielectric performance for flexible organic electronics. (C) 2016 Wiley Periodicals, Inc.
机译:在本研究中,热解法二氧化硅(SiO2)的纳米颗粒增强的聚(乙烯醇)(PVA)和聚(乙烯基吡咯烷酮)(PVP)共混物的纳米复合材料薄膜,通过一个简单的溶液共混技术制备。傅里叶变换红外光谱(FTIR),紫外可见分光法(UV-VIS),X射线衍射(XRD)和扫描电子显微镜(SEM)被用来阐明的SiO 2纳米颗粒的成功掺入在PVA / PVP共混物基质。热重分析仪来评价纳米复合材料的热稳定性。介电性能如介电常数(ε)和PVA / PVP /二氧化硅纳米复合薄膜的介电损耗(损耗角正切)在10(-2)赫兹的宽频带频率范围进行了评价,以20兆赫和温度范围40 -150摄氏度FTIR和UV-vis光谱的结果暗示的SiO 2和PVA / PVP共混物基体之间的氢键相互作用的存在。 XRD和SEM结果表明,二氧化硅纳米颗粒均匀地分散在PVA / PVP共混物基质。介电特性分析表明,该纳米复合材料的介电常数值比PVA / PVP共混物的更高。最大介电常数和介电损耗分别为125(10(-2)赫兹,150度C)和1.1(图10(-2)赫兹,70℃),分别为PVA / PVP /二氧化硅纳米复合材料与25重量%的SiO2含量。这些结果使得能够使用表现出柔性有机电子期望介电性能的简便溶液流延法的电介质纳米复合材料的制备。 (c)2016 Wiley期刊,Inc。

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