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Enhanced PVD process control by online substrate temperature measurement

机译:通过在线衬底温度测量增强PVD过程控制

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In physical vapor deposition (PVD) processes pressure and temperature are of outstanding importance for process control and coating performance. The pressure measurement and its integration into the process control are state of the art in industrial coating units. In contrast, the precise determination of the substrate temperature T-sub presents an unequally greater challenge. In PVD processes the temperature control has a great importance in two respects. On the one hand, the morphology of the coating as well as the adhesion between the coating and substrate directly depend on T-sub. On the other hand, the process temperature is limited by the maximum permissible temperature T-max as for example of heat-treated steel. Exceeding can easily lead to a critical loss of hardness and size accuracy of the substrate and production reject. The online measurement of T-sub using currently applicable systems such as drag pointer or pyrometer is either extremely complicated or simply not possible. This is particularly the case for large-volume industrial coating units with a rotating substrate table. Therefore, in coating processes, the influence of the different process parameters on T-sub is usually not quantified. Hence, T-sub is often several tens centigrades below T-max. Within the scope of this paper, a temperature measuring system developed at the Surface Engineering Institute (IOT) of the RWTH Aachen University is used in an industrial coating unit with rotating substrate table. With this, the online temperature measurement of rotating substrates is possible throughout the entire coating process, from the heating to the etching over the coating to the cooling process phase. In the heating, etching and coating process phases, the influence of the heating power on T-sub was analyzed and described by characteristic trend lines. The results were used to improve the substrate temperature profile of an industrial-like coating process with regard to T-max,. Here the temperatur
机译:在物理气相沉积(PVD)中,工艺压力和温度对于过程控制和涂层性能具有突出的重要性。压力测量及其在工艺控制中的集成是工业涂层单元中的技术。相反,基板温度T-子的精确测定具有不均更大的挑战。在PVD过程中,温度控制在两个方面具有重要意义。一方面,涂层的形态以及涂层和衬底之间的粘附直接取决于T-亚。另一方面,工艺温度受到最大允许温度T-Max的限制,例如热处理的钢。超过可以容易地导致基板和生产拒绝的临界硬度和尺寸精度的临界丧失。使用当前适用的系统(如拖指针或高温计)的T-Sub的在线测量是非常复杂或根本不可能的。对于具有旋转基板台的大批量工业涂层单元,这是特别的情况。因此,在涂覆过程中,通常未量化不同工艺参数对T-子的影响。因此,T-Sub通常在T-Max以下几十次。在本文的范围内,RWTH亚琛大学地表工程研究所(IOT)开发的温度测量系统用于工业涂层单元,具有旋转基板台。由此,在整个涂覆工艺中,旋转基板的在线温度测量是可以从加热到涂覆到冷却过程相位上的蚀刻过程中的。在加热,蚀刻和涂覆工艺相中,通过特征趋势线分析和描述了加热功率对T-级的影响。结果用于改善T-Max的工业样涂层工艺的基材温度曲线。这里的温度

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