机译:18 NI载下钢微型切割中犁散厚度与耕光深度的最小芯片厚度的测定
Shandong Univ Natl Demonstrat Ctr Expt Mech Engn Educ Key Lab High Efficiency &
Clean Mech Manufacture Minist Educ Sch Mech Engn CaJET Jinan 250061 Shandong Peoples R China;
Shandong Univ Natl Demonstrat Ctr Expt Mech Engn Educ Key Lab High Efficiency &
Clean Mech Manufacture Minist Educ Sch Mech Engn CaJET Jinan 250061 Shandong Peoples R China;
Shandong Univ Natl Demonstrat Ctr Expt Mech Engn Educ Key Lab High Efficiency &
Clean Mech Manufacture Minist Educ Sch Mech Engn CaJET Jinan 250061 Shandong Peoples R China;
Univ New South Wales Sch Mech &
Mfg Engn Sydney NSW 2052 Australia;
Shandong Univ Natl Demonstrat Ctr Expt Mech Engn Educ Key Lab High Efficiency &
Clean Mech Manufacture Minist Educ Sch Mech Engn CaJET Jinan 250061 Shandong Peoples R China;
Shandong Univ Natl Demonstrat Ctr Expt Mech Engn Educ Key Lab High Efficiency &
Clean Mech Manufacture Minist Educ Sch Mech Engn CaJET Jinan 250061 Shandong Peoples R China;
Xian Jiaotong Liverpool Univ Dept Comp Sci &
Software Engn Suzhou 215123 Peoples R China;
Micro-cutting; Minimum chip thickness; Stagnation zone; Residual stress field; Strain energy;
机译:18 NI载下钢微型切割中犁散厚度与耕光深度的最小芯片厚度的测定
机译:Viswanathan等人(1993年,Lee等人,2007年)发表在18 Ni-Co-Mo-Ti马氏体时效钢上的研究数据综述以及18 Ni-Co-Mo-Ti马氏体时效钢的时效时间预测的数学模型尝试和揭示参数效果数学Mo
机译:相等且不等壁厚混合钢的失效机制钢-P20管状关节:焊接残余应力的影响
机译:(J74-1364)使用序列部分使用序列部分使用序列部分rasmartensite块的生产行为的rasmartensite块的生产行为,使用序列段Las马氏体阻滞晶体的晶氏体晶体晶体块的行为进行晶体分析
机译:18Ni-300的选择性激光熔化
机译:平均胁迫对18%Ni载钢疲劳强度的影响