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Effects of axial ultrasonic vibration on grinding quality in peripheral grinding and end grinding of ULE

机译:轴向超声振动对外围磨削和端部磨削磨削质量的影响

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摘要

Axial ultrasonic vibration-assisted grinding has been widely proved to be effective on the ground quality as well as efficiency for hard and brittle materials. However, the deference of two typical modes, axial ultrasonic vibration-assisted peripheral grinding (AUPG, vibration directions are parallel to the ground surface) and axial ultrasonic vibration-assisted end grinding (AUEG, vibration directions are vertical to the ground surface), exerting on the grinding process has not yet been thoroughly investigated. In this paper, the single grain kinematic functions corresponding to AUPG and AUEG have been created to theoretically analyze the interactional mechanism of peripheral grinding and end grinding respectively. For AUPG and AUEG, their axial ultrasonic vibrations are capable of increasing the dynamic contact length, decreasing the chip thickness, but their different effects on grinding behavior need further investigation. A series of comparative experiments have been conducted subsequently, and the results show that under the identical material removal rate, axial vibration in AUPG and AUEG can decrease the grinding forces, while AUEG is with a lower one than AUPG with a factor of 39.80%. With regard to the ground surface quality and subsurface damage, AUPG shows a positive effect while AUEG shows a negative role. The grinding kinematic, grinding force, ground surface quality, and subsurface damage have been analyzed in terms of the axial ultrasonic vibration effect on the peripheral grinding and end grinding behavior theoretically and experimentally, the conclusion will be meaningful for researchers to choose the appropriate approach in applying axial ultrasonic vibration to grinding optical elements.
机译:轴向超声波振动辅助研磨已被广泛证明对地面质量有效,以及硬质和脆性材料的效率。然而,两个典型模式的偏见,轴向超声振动辅助外围磨削(AUPG,振动方向平行于地面)和轴向超声振动辅助端部研磨(Aueg,振动方向垂直于地面),施加在研磨过程上尚未彻底调查。在本文中,已经创建了对应于Aupg和Aueg的单颗粒运动功能,从理论上分析外围磨削和端部研磨的间隔机构。对于Aupg和Aueg,它们的轴向超声振动能够增加动态接触长度,降低芯片厚度,但它们对研磨行为的不同影响需要进一步研究。随后进行了一系列比较实验,结果表明,在相同的材料去除速率下,Aupg和Aueg中的轴向振动可以降低研磨力,而Aueg具有比Aupg的较低,则占39.80%。关于地面质量和地下损伤,Aupg显示阳性效果,而Aueg显示出负面作用。在理论上实验和实验上,在轴向超声波振动对外围研磨和结束磨削行为方面进行了研磨的运动,研磨力,地面质量和地下损坏,对研究人员来说,结论将对选择适当的方法是有意义的将轴向超声振动施加到研磨光学元件。

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